Barbara Kościelniak, Diana Groch, Wojciech J Nowak, Marcin Drajewicz, Przemysław Kwolek
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引用次数: 0
Abstract
The high-energy ball milling process was applied to fabricate a composite material from 7075 aluminium alloy milling chips, silicon carbide, and titanium dioxide powders. Raw materials were ground, and the obtained powders were cold pressed and sintered. It was demonstrated that this method can be used in the recycling of aluminium alloy scrap characterised by a high surface-to-volume ratio, and also that chemical removal of the oxide layer from chips is not necessary. The finest particles, with 50 vol.% of their population below 36 μm, were obtained after grinding for 60 min at a 1000 rpm rotational speed. Such an intensive grinding was necessary to fabricate the compact composite material with a homogeneous microstructure and a low porosity of 0.7%. The corrosion resistance of the composites was studied in 3.5 wt.% NaCl solution using cyclic voltammetry and electrochemical impedance spectroscopy, and corrosion rates in the range of ca. 342 and 3 μA∙cm-2 were obtained. The corrosion mechanism includes aluminium alloy dissolution at the matrix/reinforcement interphase and around intermetallic particles localised within the matrix grains.
期刊介绍:
Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.