Subpixel Vision Measurement Method for Rectangular-Pin SMDs Based on Asymmetric Gaussian Gradient Edge Profile

IF 9.9 1区 计算机科学 Q1 AUTOMATION & CONTROL SYSTEMS IEEE Transactions on Industrial Informatics Pub Date : 2024-11-14 DOI:10.1109/TII.2024.3488789
Weihua Liu;Yimin Wang;Juan J. Rodriguez-Andina;Xinghu Yu
{"title":"Subpixel Vision Measurement Method for Rectangular-Pin SMDs Based on Asymmetric Gaussian Gradient Edge Profile","authors":"Weihua Liu;Yimin Wang;Juan J. Rodriguez-Andina;Xinghu Yu","doi":"10.1109/TII.2024.3488789","DOIUrl":null,"url":null,"abstract":"In mounting machines, vision measurement of surface mount devices (SMDs) is a crucial task, widely used for size calculation and defect detection. However, current vision measurement methods focus on specific SMDs, such as quad flat packages. There is no unified method for measuring all kinds of rectangular-pin components, which account for more than half of the SMDs processed in mounting machines. This article presents an automatic and universal method for measuring with subpixel accuracy the parameters of rectangular-pin SMDs, which can be applied to different types of SMDs. First, an edge gradient model is proposed in the form of asymmetric Gaussian function. After that, line segments of SMDs are extracted and a line adjacency matrix is obtained that describes the relationship between lines. Then, segments are combined into long lines by searching through the line adjacency matrix. Finally, pixel line pairs are refined to subpixel level. Experimental results on the surface mount hardware platform for different components under different angles and light conditions demonstrate the high accuracy and strong robustness of the proposed method.","PeriodicalId":13301,"journal":{"name":"IEEE Transactions on Industrial Informatics","volume":"21 2","pages":"1823-1832"},"PeriodicalIF":9.9000,"publicationDate":"2024-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Industrial Informatics","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10753281/","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
引用次数: 0

Abstract

In mounting machines, vision measurement of surface mount devices (SMDs) is a crucial task, widely used for size calculation and defect detection. However, current vision measurement methods focus on specific SMDs, such as quad flat packages. There is no unified method for measuring all kinds of rectangular-pin components, which account for more than half of the SMDs processed in mounting machines. This article presents an automatic and universal method for measuring with subpixel accuracy the parameters of rectangular-pin SMDs, which can be applied to different types of SMDs. First, an edge gradient model is proposed in the form of asymmetric Gaussian function. After that, line segments of SMDs are extracted and a line adjacency matrix is obtained that describes the relationship between lines. Then, segments are combined into long lines by searching through the line adjacency matrix. Finally, pixel line pairs are refined to subpixel level. Experimental results on the surface mount hardware platform for different components under different angles and light conditions demonstrate the high accuracy and strong robustness of the proposed method.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于非对称高斯梯度边缘轮廓的矩形引脚 SMD 亚像素视觉测量方法
在贴装机械中,表面贴装器件的视觉测量是一项至关重要的任务,广泛用于尺寸计算和缺陷检测。然而,目前的视觉测量方法侧重于特定的smd,如四平面封装。在贴装机加工的贴片中,有一半以上是矩形引脚元件,而对于各种矩形引脚元件尚无统一的测量方法。本文提出了一种自动通用的亚像素精度测量矩形引脚贴片参数的方法,适用于不同类型的贴片。首先,提出了非对称高斯函数形式的边缘梯度模型。然后提取smd的线段,得到描述线段之间关系的直线邻接矩阵。然后,通过搜索直线邻接矩阵,将线段组合成长直线。最后,将像素线对细化到亚像素级。在不同角度和光照条件下不同部件的表面贴装硬件平台上的实验结果表明,该方法具有较高的精度和较强的鲁棒性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IEEE Transactions on Industrial Informatics
IEEE Transactions on Industrial Informatics 工程技术-工程:工业
CiteScore
24.10
自引率
8.90%
发文量
1202
审稿时长
5.1 months
期刊介绍: The IEEE Transactions on Industrial Informatics is a multidisciplinary journal dedicated to publishing technical papers that connect theory with practical applications of informatics in industrial settings. It focuses on the utilization of information in intelligent, distributed, and agile industrial automation and control systems. The scope includes topics such as knowledge-based and AI-enhanced automation, intelligent computer control systems, flexible and collaborative manufacturing, industrial informatics in software-defined vehicles and robotics, computer vision, industrial cyber-physical and industrial IoT systems, real-time and networked embedded systems, security in industrial processes, industrial communications, systems interoperability, and human-machine interaction.
期刊最新文献
A Novel Fusion Attention-Based Lightweight Model for Pipeline Weld Multiscale Defect Detection Data-Driven Approach to Synthetic Inertia and Droop Estimation in Behind-the-Meter Renewable Energy Sources Frequency-Enhanced Dual-Stream Parallel Network for Multienergy Load Forecasting An Intelligent Multitask Framework for Industrial Gas Leak Detection and Analysis With Infrared Optical Gas Imaging Safety-Certified Secondary Control for Transient State Constraint in Autonomous DC Microgrids via Proximal-Reserve Control Barrier Functions
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1