Weihua Liu;Yimin Wang;Juan J. Rodriguez-Andina;Xinghu Yu
{"title":"Subpixel Vision Measurement Method for Rectangular-Pin SMDs Based on Asymmetric Gaussian Gradient Edge Profile","authors":"Weihua Liu;Yimin Wang;Juan J. Rodriguez-Andina;Xinghu Yu","doi":"10.1109/TII.2024.3488789","DOIUrl":null,"url":null,"abstract":"In mounting machines, vision measurement of surface mount devices (SMDs) is a crucial task, widely used for size calculation and defect detection. However, current vision measurement methods focus on specific SMDs, such as quad flat packages. There is no unified method for measuring all kinds of rectangular-pin components, which account for more than half of the SMDs processed in mounting machines. This article presents an automatic and universal method for measuring with subpixel accuracy the parameters of rectangular-pin SMDs, which can be applied to different types of SMDs. First, an edge gradient model is proposed in the form of asymmetric Gaussian function. After that, line segments of SMDs are extracted and a line adjacency matrix is obtained that describes the relationship between lines. Then, segments are combined into long lines by searching through the line adjacency matrix. Finally, pixel line pairs are refined to subpixel level. Experimental results on the surface mount hardware platform for different components under different angles and light conditions demonstrate the high accuracy and strong robustness of the proposed method.","PeriodicalId":13301,"journal":{"name":"IEEE Transactions on Industrial Informatics","volume":"21 2","pages":"1823-1832"},"PeriodicalIF":9.9000,"publicationDate":"2024-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Industrial Informatics","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10753281/","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
引用次数: 0
Abstract
In mounting machines, vision measurement of surface mount devices (SMDs) is a crucial task, widely used for size calculation and defect detection. However, current vision measurement methods focus on specific SMDs, such as quad flat packages. There is no unified method for measuring all kinds of rectangular-pin components, which account for more than half of the SMDs processed in mounting machines. This article presents an automatic and universal method for measuring with subpixel accuracy the parameters of rectangular-pin SMDs, which can be applied to different types of SMDs. First, an edge gradient model is proposed in the form of asymmetric Gaussian function. After that, line segments of SMDs are extracted and a line adjacency matrix is obtained that describes the relationship between lines. Then, segments are combined into long lines by searching through the line adjacency matrix. Finally, pixel line pairs are refined to subpixel level. Experimental results on the surface mount hardware platform for different components under different angles and light conditions demonstrate the high accuracy and strong robustness of the proposed method.
期刊介绍:
The IEEE Transactions on Industrial Informatics is a multidisciplinary journal dedicated to publishing technical papers that connect theory with practical applications of informatics in industrial settings. It focuses on the utilization of information in intelligent, distributed, and agile industrial automation and control systems. The scope includes topics such as knowledge-based and AI-enhanced automation, intelligent computer control systems, flexible and collaborative manufacturing, industrial informatics in software-defined vehicles and robotics, computer vision, industrial cyber-physical and industrial IoT systems, real-time and networked embedded systems, security in industrial processes, industrial communications, systems interoperability, and human-machine interaction.