A PEEC-Based Fast Direct Solver for Interconnect L&R Extraction

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-11-15 DOI:10.1109/TEMC.2024.3485887
Pei Wang;Yongpin Chen;Xiaofeng Que;Jun Hu
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Abstract

A fast direct solver based on the partial element equivalent circuit is proposed for extracting the parasitic inductance and resistance of high-speed interconnects in free space. By adopting the magnetoquasistatic assumption, an equivalent circuit model for thin conductors is first constructed, where the negligible displacement current is eliminated. To lower computation costs, the mesh analysis method is then introduced to transform the system matrix of the modified nodal analysis into a compact formulation. Consequently, a hierarchically off-diagonal low-rank matrix format is applied to the resulting matrix for efficient compression and inversion. A sorting strategy is also developed to address the compression challenges posed by multiple zero matrix elements, a common occurrence due to the geometric characteristics of interconnects. The proposed method offers a solution for large and multiport interconnect problems with high accuracy, enhanced efficiency, and reduced memory requirements.
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基于 PEEC 的互连 L&R 快速直接求解器
提出了一种基于部分元件等效电路的高速互连体自由空间寄生电感和寄生电阻快速直接求解方法。采用准静磁假设,首先建立了薄导体的等效电路模型,消除了可忽略的位移电流。为了降低计算成本,引入网格分析方法,将修正节点分析的系统矩阵转化为紧凑的公式。因此,对得到的矩阵采用分层非对角低秩矩阵格式,以实现有效的压缩和反演。我们还开发了一种排序策略,以解决由多个零矩阵元素构成的压缩挑战,这是由于互连的几何特性而常见的。该方法为大型多端口互连问题提供了一种精度高、效率高、内存要求低的解决方案。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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