A PEEC-Based Fast Direct Solver for Interconnect L&R Extraction

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-11-15 DOI:10.1109/TEMC.2024.3485887
Pei Wang;Yongpin Chen;Xiaofeng Que;Jun Hu
{"title":"A PEEC-Based Fast Direct Solver for Interconnect L&R Extraction","authors":"Pei Wang;Yongpin Chen;Xiaofeng Que;Jun Hu","doi":"10.1109/TEMC.2024.3485887","DOIUrl":null,"url":null,"abstract":"A fast direct solver based on the partial element equivalent circuit is proposed for extracting the parasitic inductance and resistance of high-speed interconnects in free space. By adopting the magnetoquasistatic assumption, an equivalent circuit model for thin conductors is first constructed, where the negligible displacement current is eliminated. To lower computation costs, the mesh analysis method is then introduced to transform the system matrix of the modified nodal analysis into a compact formulation. Consequently, a hierarchically off-diagonal low-rank matrix format is applied to the resulting matrix for efficient compression and inversion. A sorting strategy is also developed to address the compression challenges posed by multiple zero matrix elements, a common occurrence due to the geometric characteristics of interconnects. The proposed method offers a solution for large and multiport interconnect problems with high accuracy, enhanced efficiency, and reduced memory requirements.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 1","pages":"332-336"},"PeriodicalIF":2.0000,"publicationDate":"2024-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10754892/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

A fast direct solver based on the partial element equivalent circuit is proposed for extracting the parasitic inductance and resistance of high-speed interconnects in free space. By adopting the magnetoquasistatic assumption, an equivalent circuit model for thin conductors is first constructed, where the negligible displacement current is eliminated. To lower computation costs, the mesh analysis method is then introduced to transform the system matrix of the modified nodal analysis into a compact formulation. Consequently, a hierarchically off-diagonal low-rank matrix format is applied to the resulting matrix for efficient compression and inversion. A sorting strategy is also developed to address the compression challenges posed by multiple zero matrix elements, a common occurrence due to the geometric characteristics of interconnects. The proposed method offers a solution for large and multiport interconnect problems with high accuracy, enhanced efficiency, and reduced memory requirements.
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基于 PEEC 的互连 L&R 快速直接求解器
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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