Remarkable enhancement of thermal conductivity induced by coordination transition in SiO2 thin films

IF 3.5 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Journal of Materials Science Pub Date : 2024-11-04 DOI:10.1007/s10853-024-10391-3
Mingyang Kong, Zhichun Liu, Haigang Wang, Dezhi Xu, Hanbin Wang, Zhipeng Zhao, Zhengxing Huang, Junsheng Liang
{"title":"Remarkable enhancement of thermal conductivity induced by coordination transition in SiO2 thin films","authors":"Mingyang Kong,&nbsp;Zhichun Liu,&nbsp;Haigang Wang,&nbsp;Dezhi Xu,&nbsp;Hanbin Wang,&nbsp;Zhipeng Zhao,&nbsp;Zhengxing Huang,&nbsp;Junsheng Liang","doi":"10.1007/s10853-024-10391-3","DOIUrl":null,"url":null,"abstract":"<p>The heat transfer in SiO<sub>2</sub> is mainly dominated by phonons, but the void defects and boundary effects in the films cause strong scattering of phonons, resulting in a low thermal conductivity. Herein, we report the SiO<sub>2</sub> thin films with prominently enhanced thermal conductivity after high-temperature annealing. Through combined experiments and non-equilibrium molecular dynamics simulation, we reveal the improvement of thermal conductivity that is originally attributed to coordination transition during the high-temperature annealing. Analysis indicates that a more ordered atom structure and denser grain boundaries could derive from the coordination transition, resulting in the crystallization of grains and defect mending. These behaviors induce a reduction of phonons scattering and increase in mean free path, which lead to nearly twofold enhance in the thermal conductivity to 2.66 Wm<sup>−1</sup> K<sup>−1</sup>.</p>","PeriodicalId":645,"journal":{"name":"Journal of Materials Science","volume":"59 43","pages":"20325 - 20334"},"PeriodicalIF":3.5000,"publicationDate":"2024-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10853-024-10391-3","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

The heat transfer in SiO2 is mainly dominated by phonons, but the void defects and boundary effects in the films cause strong scattering of phonons, resulting in a low thermal conductivity. Herein, we report the SiO2 thin films with prominently enhanced thermal conductivity after high-temperature annealing. Through combined experiments and non-equilibrium molecular dynamics simulation, we reveal the improvement of thermal conductivity that is originally attributed to coordination transition during the high-temperature annealing. Analysis indicates that a more ordered atom structure and denser grain boundaries could derive from the coordination transition, resulting in the crystallization of grains and defect mending. These behaviors induce a reduction of phonons scattering and increase in mean free path, which lead to nearly twofold enhance in the thermal conductivity to 2.66 Wm−1 K−1.

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
二氧化硅薄膜中配位转变诱发的热导率显著增强
二氧化硅中的传热主要由声子主导,但薄膜中的空隙缺陷和边界效应会引起声子的强烈散射,从而导致热导率较低。在此,我们报告了经过高温退火后热导率显著增强的二氧化硅薄膜。通过结合实验和非平衡分子动力学模拟,我们揭示了热导率的提高最初归因于高温退火过程中的配位转变。分析表明,更有序的原子结构和更致密的晶界可能源于配位转变,从而导致晶粒结晶和缺陷修补。这些行为导致声子散射减少和平均自由路径增加,从而使热导率提高了近两倍,达到 2.66 Wm-1 K-1。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Journal of Materials Science
Journal of Materials Science 工程技术-材料科学:综合
CiteScore
7.90
自引率
4.40%
发文量
1297
审稿时长
2.4 months
期刊介绍: The Journal of Materials Science publishes reviews, full-length papers, and short Communications recording original research results on, or techniques for studying the relationship between structure, properties, and uses of materials. The subjects are seen from international and interdisciplinary perspectives covering areas including metals, ceramics, glasses, polymers, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, and biological and biomedical materials. The Journal of Materials Science is now firmly established as the leading source of primary communication for scientists investigating the structure and properties of all engineering materials.
期刊最新文献
The influence of entanglement degree controlled by complex shear field on the performance of long-chain branched polypropylene Investigation on the microstructure and mechanical properties of 5356 aluminum alloy wire in continuous casting direct rolling process Crystallization behavior and thermal properties of octa-phenyl-substituted silsesquioxane-modified polylactide (PLA) Integrating dye-sensitized solar cells and supercapacitors: portable powerpacks for future energy applications High-security organic PVDF-coated SiO2 aerogel lithium battery separator
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1