Material deformation mechanism of polycrystalline tin in nanometric cutting

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2024-11-15 DOI:10.1016/j.jmapro.2024.11.021
Zhifu Xue , Min Lai , Feifei Xu , Fengzhou Fang
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Abstract

The surface generation and subsurface deformation mechanisms of polycrystalline tin in nanometric cutting are investigated using molecular dynamics. Subsurface deformations such as amorphization, phase transformation, grain boundary migration, and grain rotation during machining are observed. The distribution of hydrostatic stress and the evolution of the crystal structure are analyzed to determine the causes of cutting force fluctuations. The effects of undeformed chip thickness and cutting speed on material removal and subsurface deformation are also examined. Results show that the propagation of deformation is suppressed by the grain boundaries, and the grain boundary steps on the machined surfaces are expanded by deformation recovery. In addition, the removal behavior of polycrystalline tin is remarkably affected by the grain size and crystal orientation.
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纳米切割中多晶锡的材料变形机理
利用分子动力学研究了纳米切削中多晶锡的表面生成和表层下变形机制。观察了加工过程中的非晶化、相变、晶界迁移和晶粒旋转等次表层变形。分析了静水压力的分布和晶体结构的演变,以确定切削力波动的原因。此外,还研究了未变形切屑厚度和切削速度对材料去除和表面下变形的影响。结果表明,变形的传播受到晶界的抑制,加工表面上的晶界台阶因变形恢复而扩大。此外,多晶锡的移除行为明显受到晶粒尺寸和晶体取向的影响。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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