Nadeem Fayaz Lone , Namrata Gangil , Dhruv Bajaj , Amit Arora , Daolun Chen , Arshad Noor Siddiquee
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引用次数: 0
Abstract
4D printing refers to the additive manufacturing of a component by incorporating smart materials. The smart materials add the “4th dimension” to 3D-printing by altering the shape/functionality/configuration of the part in response to external stimulus such as heat, stress, pH, electric field, etc. In the current study, shape memory alloy (SMA) plugs were implanted into mild-steel via gas metal arc welding (GMAW) assisted wire-arc additive manufacturing (WAAM). The NiTi SMA powder was employed as secondary addition within the printed layers, while the FeMnSi based alloy evolved in-situ during the 4D-printing process. Significant elemental heterogeneity was found in the Fe-Mn-Si based SMA plugs containing NiFe rich solidified droplets, owing to the composition of the wire used for deposition. The NiFe rich phases depicted the substitution of Ti by Fe in the NiTi pre-cursors. The large SMA plugs incorporated into the printed mild steel depicted the formation of a macro composite structure. The presented results are expected to considerably reduce the cost of SMA application through the printing of novel monolithic SMA-steel composites using wires and SMA powders as raw materials.
4D 打印是指采用智能材料对部件进行增材制造。智能材料可在热量、应力、pH 值、电场等外部刺激下改变零件的形状/功能/配置,从而为三维打印增添 "第四维"。在当前的研究中,通过气体金属弧焊(GMAW)辅助线弧增材制造(WAAM)将形状记忆合金(SMA)塞植入低碳钢中。在 4D 打印过程中,镍钛 SMA 粉末被用作打印层内的二次添加物,而基于铁锰硅的合金则在原位演化。由于沉积所用金属丝的成分不同,在含有富含镍铁合金凝固液滴的铁锰硅基 SMA 塞中发现了明显的元素异质性。富含 NiFe 的物相表明,在 NiTi 前驱体中 Ti 被 Fe 取代。印刷低碳钢中的大块 SMA 塞描述了宏观复合结构的形成。通过使用金属丝和 SMA 粉末作为原材料打印新型整体 SMA 钢复合材料,上述结果有望大大降低 SMA 的应用成本。
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.