Dual-Band LTCC Substrate Integrated Cavity Slot Antenna Arrays in D-Band for 6G IoT Applications

IF 8.9 1区 计算机科学 Q1 COMPUTER SCIENCE, INFORMATION SYSTEMS IEEE Internet of Things Journal Pub Date : 2024-11-20 DOI:10.1109/JIOT.2024.3503371
Dongxu Wang;Kai-Da Xu
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Abstract

High-speed vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications will be crucial for traffic efficiency within intelligent transportation systems in the near future, which necessitates antennas operating at high frequencies with high gains and compact sizes. In this article, we propose a dual-band substrate integrated cavity (SIC) slot antenna operating in D-band along with its array applications. The antenna excites two high-order radiation modes and utilizes four radiating slots on its top surface to achieve dual-band radiation. Compared to antennas using fundamental modes, the employment of high-order modes results in antennas with larger dimensions, which facilitates fabrication especially in D-band. To accommodate different application scenarios, two antenna arrays are designed, fabricated, and measured. By vertically arranging the feeding networks, a significant reduction in overall antenna size is achieved. The proposed antenna arrays are fabricated by low temperature co-fired ceramic (LTCC) technology which guarantees structural stability, high processing precision, and multilayered design. Benefiting from high-performance substrate integrated waveguide (SIW) feeding networks, the measured results are reasonably in agreement with the simulated ones. A $2\times 2$ SIC slot antenna array achieves radiation at 150.8 and 166.5 GHz, with gains of 12.1 and 12.4 dBi, respectively. Additionally, a $1\times 4$ SIC slot antenna array achieves radiation at beam pointing angles of −25° and −20° with gains of 7.2 and 10.3 dBi at 147.95 and 163.25 GHz, respectively. As new types of dual-band antenna arrays working in D-band for the first time, they provide promising options for sixth generation Internet of Things (IoT) applications.
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用于 6G 物联网应用的 D 波段双频 LTCC 基底集成腔槽天线阵列
在不久的将来,高速车对车(V2V)和车对基础设施(V2I)通信将对智能交通系统的交通效率至关重要,这就需要在高频率、高增益和紧凑尺寸下运行的天线。在本文中,我们提出了一种工作在d波段的双频基片集成腔(SIC)槽天线及其阵列应用。该天线激发两种高阶辐射模式,并利用其顶部表面的四个辐射槽实现双频辐射。与使用基模的天线相比,使用高阶模的天线尺寸更大,特别是在d波段的制造更方便。为了适应不同的应用场景,设计、制作和测量了两个天线阵列。通过垂直布置馈电网络,实现了总体天线尺寸的显著减小。所提出的天线阵列采用低温共烧陶瓷(LTCC)技术制造,保证了结构稳定性、加工精度高和多层设计。得益于高性能的衬底集成波导馈电网络,测量结果与仿真结果基本吻合。2 × 2 SIC槽位天线阵列可实现150.8 GHz和166.5 GHz的辐射,增益分别为12.1和12.4 dBi。另外,在147.95 GHz和163.25 GHz频段,1 × 4 SIC缝隙天线阵列的波束指向角分别为- 25°和- 20°,增益分别为7.2和10.3 dBi。作为首次在d波段工作的新型双频天线阵列,它们为第六代物联网(IoT)应用提供了有希望的选择。
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来源期刊
IEEE Internet of Things Journal
IEEE Internet of Things Journal Computer Science-Information Systems
CiteScore
17.60
自引率
13.20%
发文量
1982
期刊介绍: The EEE Internet of Things (IoT) Journal publishes articles and review articles covering various aspects of IoT, including IoT system architecture, IoT enabling technologies, IoT communication and networking protocols such as network coding, and IoT services and applications. Topics encompass IoT's impacts on sensor technologies, big data management, and future internet design for applications like smart cities and smart homes. Fields of interest include IoT architecture such as things-centric, data-centric, service-oriented IoT architecture; IoT enabling technologies and systematic integration such as sensor technologies, big sensor data management, and future Internet design for IoT; IoT services, applications, and test-beds such as IoT service middleware, IoT application programming interface (API), IoT application design, and IoT trials/experiments; IoT standardization activities and technology development in different standard development organizations (SDO) such as IEEE, IETF, ITU, 3GPP, ETSI, etc.
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