{"title":"Online Condition Monitoring of Bonding Wires Lift-Off in Power Modules Based on Magnetic Field Measurement","authors":"Weili Guo;Guochun Xiao;Laili Wang","doi":"10.1109/TPEL.2024.3503722","DOIUrl":null,"url":null,"abstract":"Wire-bonding type power modules are among the most widely used power semiconductor module packages in recent years, with bonding wires being one of the weakest links in these modules. Under the long-term effects of power cycling and temperature fluctuations, stress and strain make bonding wires prone to cracking, eventually leading to breakage or detachment, which affects the reliability of power modules. Therefore, monitoring the health condition of power modules is crucial. This article proposes a method for real-time monitoring of bonding wire lift-off using a single-axis magnetic field sensor. The article first analyzes the magnetic field near the bonding wires of the power module, indicating that the magnetic field changes when bonding wires lift off. Second, finite-element method is used to simulate the magnetic field and identify the region with the highest rate of magnetic field change due to bonding wires lift off, where the magnetic field sensor is placed to achieve the highest monitoring sensitivity. Additionally, by using a temperature compensation method, the change in magnetic field sensor sensitivity due to temperature variations was reduced. This method decreased the sensitivity deviation caused by temperature changes from approximately 30% to less than 1%. In the experiment, the bonding wires of two types of power semiconductor modules were monitored. Using a magnetic field to current ratio deviation of ±5% as the standard, the occurrence of bonding wire lift-off could be accurately detected.","PeriodicalId":13267,"journal":{"name":"IEEE Transactions on Power Electronics","volume":"40 3","pages":"4425-4436"},"PeriodicalIF":6.5000,"publicationDate":"2024-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Power Electronics","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10759846/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Wire-bonding type power modules are among the most widely used power semiconductor module packages in recent years, with bonding wires being one of the weakest links in these modules. Under the long-term effects of power cycling and temperature fluctuations, stress and strain make bonding wires prone to cracking, eventually leading to breakage or detachment, which affects the reliability of power modules. Therefore, monitoring the health condition of power modules is crucial. This article proposes a method for real-time monitoring of bonding wire lift-off using a single-axis magnetic field sensor. The article first analyzes the magnetic field near the bonding wires of the power module, indicating that the magnetic field changes when bonding wires lift off. Second, finite-element method is used to simulate the magnetic field and identify the region with the highest rate of magnetic field change due to bonding wires lift off, where the magnetic field sensor is placed to achieve the highest monitoring sensitivity. Additionally, by using a temperature compensation method, the change in magnetic field sensor sensitivity due to temperature variations was reduced. This method decreased the sensitivity deviation caused by temperature changes from approximately 30% to less than 1%. In the experiment, the bonding wires of two types of power semiconductor modules were monitored. Using a magnetic field to current ratio deviation of ±5% as the standard, the occurrence of bonding wire lift-off could be accurately detected.
期刊介绍：
The IEEE Transactions on Power Electronics journal covers all issues of widespread or generic interest to engineers who work in the field of power electronics. The Journal editors will enforce standards and a review policy equivalent to the IEEE Transactions, and only papers of high technical quality will be accepted. Papers which treat new and novel device, circuit or system issues which are of generic interest to power electronics engineers are published. Papers which are not within the scope of this Journal will be forwarded to the appropriate IEEE Journal or Transactions editors. Examples of papers which would be more appropriately published in other Journals or Transactions include: 1) Papers describing semiconductor or electron device physics. These papers would be more appropriate for the IEEE Transactions on Electron Devices. 2) Papers describing applications in specific areas: e.g., industry, instrumentation, utility power systems, aerospace, industrial electronics, etc. These papers would be more appropriate for the Transactions of the Society which is concerned with these applications. 3) Papers describing magnetic materials and magnetic device physics. These papers would be more appropriate for the IEEE Transactions on Magnetics. 4) Papers on machine theory. These papers would be more appropriate for the IEEE Transactions on Power Systems. While original papers of significant technical content will comprise the major portion of the Journal, tutorial papers and papers of historical value are also reviewed for publication.
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