Investigation of photocatalysis/vibration-assisted finishing of reaction sintered silicon carbide

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2024-11-26 DOI:10.1016/j.jmapro.2024.11.027
Zhichao Geng, Fengzhou Fang
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Abstract

Reaction-sintered silicon carbide (RS-SiC) is an ideal material for spacecraft reflectors due to its excellent mechanical properties. However, its high hardness, brittleness, and multiphase nature pose significant challenges to conventional polishing techniques. To address this, photocatalytic modification and vibration assistance have been employed to enhance both precision and efficiency in the polishing process of RS-SiC. In this work, the oxidative properties of RS-SiC surface during photocatalytic reaction are elucidated using molecular dynamics simulation coupled with X-ray photoelectron spectroscopy analysis. Parameters including concentration of TiO2 and H2O2, frequency, and amplitude of vibration table are optimized, indicating that the TiO2 concentration serves as the primary influence on the oxidation rate. Further investigation into the effects of spindle rotation speed and polishing pressure during the material removal process shows that roughness is minimized when material removal rate equals oxidation rate. Ultimately, on the basis of optimized parameters, a material removal rate reaching 2.1 μm/h and surface roughness of 0.26 nm in Ra are achieved. This study provides significant guidance for the further application of photocatalysis/vibration-assisted finishing technology.
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反应烧结碳化硅的光催化/振动辅助精加工研究
反应烧结碳化硅(RS-SiC)具有优异的机械性能,是航天器反射器的理想材料。然而,它的高硬度、脆性和多相性给传统抛光技术带来了巨大挑战。为了解决这一问题,我们采用了光催化改性和振动辅助技术来提高 RS-SiC 抛光过程的精度和效率。本研究利用分子动力学模拟结合 X 射线光电子能谱分析,阐明了 RS-SiC 表面在光催化反应过程中的氧化特性。对 TiO2 和 H2O2 的浓度、振动台的频率和振幅等参数进行了优化,结果表明 TiO2 浓度是影响氧化率的主要因素。对材料去除过程中主轴转速和抛光压力影响的进一步研究表明,当材料去除率等于氧化率时,粗糙度最小。最终,在优化参数的基础上,材料去除率达到 2.1 μm/h,表面粗糙度达到 0.26 nm(Ra)。这项研究为进一步应用光催化/振动辅助精加工技术提供了重要指导。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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