Huizi Chen , Nan Zou , Yuming Xie , Xiangchen Meng , Xiaotian Ma , Naijie Wang , Yongxian Huang
{"title":"Wire-based friction stir additive manufacturing of AlCu alloy with forging mechanical properties","authors":"Huizi Chen , Nan Zou , Yuming Xie , Xiangchen Meng , Xiaotian Ma , Naijie Wang , Yongxian Huang","doi":"10.1016/j.jmapro.2024.11.037","DOIUrl":null,"url":null,"abstract":"<div><div>Aluminum‑copper (Al<img>Cu) alloy load-bearing structures fabricated via fusion-based additive-manufacturing methods are highly sensitive to the occurrence of porosities during solidification and grain coarsening during high energy input, which is yet to be appropriately addressed in printing high-performance components. Here, a novel additive manufacturing technology named wire-based friction stir additive manufacturing (W-FSAM) was proposed to fabricate high-strength Al<img>Cu alloy load-bearing parts with ultrafine-grained structures and uniformly dispersed precipitates. Ultrafine equiaxed grains were obtained with the grain size of about 1.62 ± 0.26 μm. A large amount of θ' phases were uniformly precipitated after heat-treated process. The mechanical properties of W-FSAM Al<img>Cu alloy specimens reached 283.0 ± 2.7 MPa and 413.7 ± 6.7 MPa in terms of yield strength and ultimate tensile strength after heat-treated process, which mechanical properties have reached the forging parts. Precipitate strengthening accounted for 70.4 % of strengthening factors was considered as the main strengthening mechanism. These mechanical properties are expected to have options for fabricating high-performance bear-loading structures of Al<img>Cu alloys.</div></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":"133 ","pages":"Pages 354-366"},"PeriodicalIF":6.1000,"publicationDate":"2024-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612524011952","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
Aluminum‑copper (AlCu) alloy load-bearing structures fabricated via fusion-based additive-manufacturing methods are highly sensitive to the occurrence of porosities during solidification and grain coarsening during high energy input, which is yet to be appropriately addressed in printing high-performance components. Here, a novel additive manufacturing technology named wire-based friction stir additive manufacturing (W-FSAM) was proposed to fabricate high-strength AlCu alloy load-bearing parts with ultrafine-grained structures and uniformly dispersed precipitates. Ultrafine equiaxed grains were obtained with the grain size of about 1.62 ± 0.26 μm. A large amount of θ' phases were uniformly precipitated after heat-treated process. The mechanical properties of W-FSAM AlCu alloy specimens reached 283.0 ± 2.7 MPa and 413.7 ± 6.7 MPa in terms of yield strength and ultimate tensile strength after heat-treated process, which mechanical properties have reached the forging parts. Precipitate strengthening accounted for 70.4 % of strengthening factors was considered as the main strengthening mechanism. These mechanical properties are expected to have options for fabricating high-performance bear-loading structures of AlCu alloys.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.