{"title":"Negligible Influence of C-related Defect on the Barrier Properties of Ti3C2T2/SiC Contacts: A First-Principles Study","authors":"Liuqiang Gu, Lingqin Huang, Junqiang Wang, Xiaogang Gu","doi":"10.1016/j.jallcom.2024.177850","DOIUrl":null,"url":null,"abstract":"The nature of the metal/semiconductor (M/S) contact (Ohmic or Schottky) in electronic devices can greatly affect the electronic properties of the component. The effective regulation of Schottky barrier height (SBH) has great importance for the successful operation of any electronic device. This paper demonstrates that the Ti<sub>3</sub>C<sub>2</sub>T<sub>2</sub>/SiC interface can effectively suppress the Fermi level pinning (FLP) effect through van der Waals stacking. By investigating the effects of the most probable C-related defect, namely carbon substitutional doping at silicon sites (C<sub>Si</sub> defects), on the contact performance of Ti<sub>3</sub>C<sub>2</sub>T<sub>2</sub>/SiC. It is found that C<sub>Si</sub> defects do not affect the contact type of Ti<sub>3</sub>C<sub>2</sub>T<sub>2</sub>/SiC and have little impact on the tunneling barrier. In addition, the SBH of Ti<sub>3</sub>C<sub>2</sub>T<sub>2</sub>/SiC could be modulated by a vertical electric field, without altering the tunneling barrier. The modulation is also not influenced by the C<sub>Si</sub> defects. Furthermore, based on the calculated Schottky and tunneling barriers, Ti<sub>3</sub>C<sub>2</sub>(OH)<sub>2</sub> is the most compatible electrode with 2D SiC among the Ti<sub>3</sub>C<sub>2</sub>T<sub>2</sub>, even in the presence of C<sub>Si</sub> defects in SiC.","PeriodicalId":344,"journal":{"name":"Journal of Alloys and Compounds","volume":"9 1","pages":""},"PeriodicalIF":5.8000,"publicationDate":"2024-11-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.jallcom.2024.177850","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The nature of the metal/semiconductor (M/S) contact (Ohmic or Schottky) in electronic devices can greatly affect the electronic properties of the component. The effective regulation of Schottky barrier height (SBH) has great importance for the successful operation of any electronic device. This paper demonstrates that the Ti3C2T2/SiC interface can effectively suppress the Fermi level pinning (FLP) effect through van der Waals stacking. By investigating the effects of the most probable C-related defect, namely carbon substitutional doping at silicon sites (CSi defects), on the contact performance of Ti3C2T2/SiC. It is found that CSi defects do not affect the contact type of Ti3C2T2/SiC and have little impact on the tunneling barrier. In addition, the SBH of Ti3C2T2/SiC could be modulated by a vertical electric field, without altering the tunneling barrier. The modulation is also not influenced by the CSi defects. Furthermore, based on the calculated Schottky and tunneling barriers, Ti3C2(OH)2 is the most compatible electrode with 2D SiC among the Ti3C2T2, even in the presence of CSi defects in SiC.
期刊介绍:
The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.