Young Professionals: Report on the IEEE DEIS Fellowship

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electrical Insulation Magazine Pub Date : 2024-12-12 DOI:10.1109/MEI.2025.10794808
Praveen Sahu
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Abstract

I am delighted to share my experience on the successful completion of the proposed project with the support of the DEIS Graduate Student Fellowship and my attendance at the prestigious IEEE International Power Modulator and High Voltage Conference (IPMHVC) 2024 in Indianapolis, Indiana. I also extend my deepest gratitude to my advisors, Dr. Raji Sundararajan and Dr. Ignacio Camarillo, for their unwavering support and guidance, which were instrumental in preparing for this conference.
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青年专业人员:IEEE DEIS奖学金报告
在DEIS研究生奖学金的支持下,我很高兴能够分享我在成功完成拟议项目方面的经验,并出席在印第安纳州印第安纳波利斯举行的著名的IEEE国际功率调制器和高压会议(IPMHVC) 2024。我还要向我的顾问Raji Sundararajan博士和Ignacio Camarillo博士表示最深切的感谢,感谢他们坚定不移的支持和指导,为筹备这次会议发挥了重要作用。
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来源期刊
IEEE Electrical Insulation Magazine
IEEE Electrical Insulation Magazine 工程技术-工程:电子与电气
CiteScore
4.60
自引率
3.40%
发文量
121
审稿时长
>12 weeks
期刊介绍: The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.
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