A Fully Row/Column-Parallel MRAM in-Memory Computing Macro With Memory-Resistance Boosting and Weighted Multi-Column ADC Readout

IF 5.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Journal of Solid-state Circuits Pub Date : 2024-12-16 DOI:10.1109/JSSC.2024.3512360
Peter Deaville;Bonan Zhang;Naveen Verma
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Abstract

This work demonstrates a 256(row) ${\times } 512$ (col.) fully row/column-parallel in-memory computing (IMC) macro employing foundry MRAM in 22-nm FD-SOI CMOS. Embedded nonvolatile memory (eNVM) offers advantages in density, nonvolatility, and scalability in advanced technology nodes compared to SRAM, but incurs worse signal-to-noise ratio (SNR) challenges which restrict row parallelism and exacerbate readout overheads, thus limiting achievable IMC throughput and energy efficiency. The presented prototype enables high row parallelism, as well as high-sensitivity and power/area-efficient readout, via a cascode-based feedback architecture. The feedback architecture performs linear conductance-to-current conversion, which enables signal weighting and summation to feed a single multi-column ADC. The ADC employs a conductance-feedback SAR architecture to achieve a high resolution of 6 b. The prototype demonstrates compute density of 5.5 1b-TOPS/mm2 and energy efficiency of 19.5-41.6 1b-TOPS/W, using an unmodified foundry bit-cell and memory array. Operation is verified with a six-layer VGG-style convolutional neural network (NN), achieving 90.25% accuracy on CIFAR-10, and 71.08% on CIFAR-100, both equivalent to ideal software accuracy.
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具有内存阻抗提升和加权多列 ADC 读出功能的全行/列并行 MRAM 内存计算宏程序
这项工作展示了一个256(行)${\times} 512$ (col.)全行/列并行内存计算(IMC)宏,采用22纳米FD-SOI CMOS的代工厂MRAM。与SRAM相比,嵌入式非易失性存储器(eNVM)在密度、非易失性和先进技术节点的可扩展性方面具有优势,但会带来更糟糕的信噪比(SNR)挑战,这限制了行并行性并增加了读出开销,从而限制了可实现的IMC吞吐量和能效。该原型通过基于级联码的反馈架构实现了高行并行性,以及高灵敏度和功率/面积效率的读出。反馈架构执行线性电导-电流转换,使信号加权和求和能够馈送单个多列ADC。ADC采用电导反馈SAR架构,可实现6 b的高分辨率。原型样机采用未经修改的代工位单元和存储阵列,计算密度为5.5 1b-TOPS/mm2,能效为19.5-41.6 1b-TOPS/W。使用六层vgg式卷积神经网络(NN)验证操作,CIFAR-10和CIFAR-100的准确率分别达到90.25%和71.08%,均达到理想的软件准确率。
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来源期刊
IEEE Journal of Solid-state Circuits
IEEE Journal of Solid-state Circuits 工程技术-工程:电子与电气
CiteScore
11.00
自引率
20.40%
发文量
351
审稿时长
3-6 weeks
期刊介绍: The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.
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