{"title":"A Fully Row/Column-Parallel MRAM in-Memory Computing Macro With Memory-Resistance Boosting and Weighted Multi-Column ADC Readout","authors":"Peter Deaville;Bonan Zhang;Naveen Verma","doi":"10.1109/JSSC.2024.3512360","DOIUrl":null,"url":null,"abstract":"This work demonstrates a 256(row)<inline-formula> <tex-math>${\\times } 512$ </tex-math></inline-formula>(col.) fully row/column-parallel in-memory computing (IMC) macro employing foundry MRAM in 22-nm FD-SOI CMOS. Embedded nonvolatile memory (eNVM) offers advantages in density, nonvolatility, and scalability in advanced technology nodes compared to SRAM, but incurs worse signal-to-noise ratio (SNR) challenges which restrict row parallelism and exacerbate readout overheads, thus limiting achievable IMC throughput and energy efficiency. The presented prototype enables high row parallelism, as well as high-sensitivity and power/area-efficient readout, via a cascode-based feedback architecture. The feedback architecture performs linear conductance-to-current conversion, which enables signal weighting and summation to feed a single multi-column ADC. The ADC employs a conductance-feedback SAR architecture to achieve a high resolution of 6 b. The prototype demonstrates compute density of 5.5 1b-TOPS/mm2 and energy efficiency of 19.5-41.6 1b-TOPS/W, using an unmodified foundry bit-cell and memory array. Operation is verified with a six-layer VGG-style convolutional neural network (NN), achieving 90.25% accuracy on CIFAR-10, and 71.08% on CIFAR-100, both equivalent to ideal software accuracy.","PeriodicalId":13129,"journal":{"name":"IEEE Journal of Solid-state Circuits","volume":"60 5","pages":"1856-1866"},"PeriodicalIF":5.6000,"publicationDate":"2024-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal of Solid-state Circuits","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10801203/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This work demonstrates a 256(row)${\times } 512$ (col.) fully row/column-parallel in-memory computing (IMC) macro employing foundry MRAM in 22-nm FD-SOI CMOS. Embedded nonvolatile memory (eNVM) offers advantages in density, nonvolatility, and scalability in advanced technology nodes compared to SRAM, but incurs worse signal-to-noise ratio (SNR) challenges which restrict row parallelism and exacerbate readout overheads, thus limiting achievable IMC throughput and energy efficiency. The presented prototype enables high row parallelism, as well as high-sensitivity and power/area-efficient readout, via a cascode-based feedback architecture. The feedback architecture performs linear conductance-to-current conversion, which enables signal weighting and summation to feed a single multi-column ADC. The ADC employs a conductance-feedback SAR architecture to achieve a high resolution of 6 b. The prototype demonstrates compute density of 5.5 1b-TOPS/mm2 and energy efficiency of 19.5-41.6 1b-TOPS/W, using an unmodified foundry bit-cell and memory array. Operation is verified with a six-layer VGG-style convolutional neural network (NN), achieving 90.25% accuracy on CIFAR-10, and 71.08% on CIFAR-100, both equivalent to ideal software accuracy.
期刊介绍:
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.