Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-12-16 DOI:10.1109/TEMC.2024.3511254
Mingtai Li;Tuanjie Li
{"title":"Passive Intermodulation Model Based on Conductors Cross-Section for Printed Transmission Line","authors":"Mingtai Li;Tuanjie Li","doi":"10.1109/TEMC.2024.3511254","DOIUrl":null,"url":null,"abstract":"When the cross section of a transmission line (TL) with a complex shape affects the internal electromagnetic field distribution of the conductor, it is necessary to combine the numerical method and the cross-sectional shape of the conductor to calculate the electrothermal passive intermodulation (ET PIM) current density caused by the uneven current distribution. Therefore, to analyze the influence of TL cross-sectional geometry on ET PIM, an ET PIM model of TL considering conductor cross-sectional geometry and transmission loss is derived. In the model, the modified gradient model is defined to characterize the nonlinear conductivity and conductor loss. Meanwhile, the PIM measurement experiments of the microstrip line, meshed microstrip line and parallel plate waveguide are designed to compare numerical solutions of the ET PIM3 model. Finally, numerical analyses of cross-sectional geometry effects on ET PIM3 generation are made to explain the phenomenon of ET PIM3 measurement. Combined with the measurement results, the numerical solution shows that the ET PIM produced in the high current density region is affected by the cross-sectional geometry, frequency offset, and thermal flux.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"634-643"},"PeriodicalIF":2.5000,"publicationDate":"2024-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10804061/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

When the cross section of a transmission line (TL) with a complex shape affects the internal electromagnetic field distribution of the conductor, it is necessary to combine the numerical method and the cross-sectional shape of the conductor to calculate the electrothermal passive intermodulation (ET PIM) current density caused by the uneven current distribution. Therefore, to analyze the influence of TL cross-sectional geometry on ET PIM, an ET PIM model of TL considering conductor cross-sectional geometry and transmission loss is derived. In the model, the modified gradient model is defined to characterize the nonlinear conductivity and conductor loss. Meanwhile, the PIM measurement experiments of the microstrip line, meshed microstrip line and parallel plate waveguide are designed to compare numerical solutions of the ET PIM3 model. Finally, numerical analyses of cross-sectional geometry effects on ET PIM3 generation are made to explain the phenomenon of ET PIM3 measurement. Combined with the measurement results, the numerical solution shows that the ET PIM produced in the high current density region is affected by the cross-sectional geometry, frequency offset, and thermal flux.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于印刷传输线导体截面的无源互调模型
当形状复杂的传输线截面影响导体内部电磁场分布时,有必要将数值方法与导体截面形状相结合,计算由电流分布不均匀引起的电热无源互调(ET PIM)电流密度。因此,为了分析TL截面几何形状对ET PIM的影响,推导了考虑导体截面几何形状和传输损耗的TL ET PIM模型。在模型中,定义了修正梯度模型来表征非线性电导率和导体损耗。同时,设计了微带线、网状微带线和平行板波导的PIM测量实验,比较了ET PIM3模型的数值解。最后,对横截面几何效应对ET PIM3产生的影响进行了数值分析,以解释ET PIM3测量的现象。结合实测结果,数值解表明,在高电流密度区域产生的ET PIM受截面几何形状、频率偏移和热通量的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
期刊最新文献
A Shielded Planar Loop Magnetic Field Probe in PCB Technology for EMC Measurements and Calibration Method A Corner-Optimized Asterisk-Shaped Composite Magnetic Shield for WPT Systems With Rectangular Coils Approximate Analytical Solutions for the Time-Domain Shielding of Plane Electromagnetic Waves Through an Infinite Conducting Plate EMTR-Based Branch Identification for Accurate and Fast Fault Location Superior Electromagnetic Shielding for Non-Bearing Masonry Walls Using Innovative Conductive Infills and FRCC Coatings
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1