Ludovica Illiano;Xiaokang Liu;Flavia Grassi;Sergio A. Pignari
{"title":"Analysis and Optimization of Fast Ethernet Terminations for Reduction of Differential-to-Common-Mode Conversion","authors":"Ludovica Illiano;Xiaokang Liu;Flavia Grassi;Sergio A. Pignari","doi":"10.1109/TEMC.2024.3523962","DOIUrl":null,"url":null,"abstract":"Bob Smith (BS) termination is usually adopted to terminate twisted wired pairs in order to reduce common mode (CM) interference, as suggested by Ethernet board design guidelines compliant with the 100BASE-TX standard. However, there is not a robust proof of the effectiveness of the specific component values for this termination. This article proposes a detailed analysis and design technique for the termination components that allow for effectively suppressing CM disturbance at the Ethernet board transmission driver ports. The focus is on the analysis of the CM reflection and differential-to- CM conversion. To this end, an equivalent circuit of the system is derived and characterized at the transmission ports by a suitably-reduced mixed-mode <italic>S</i>-parameters matrix. Parametric analysis and multiobjective optimization are used to optimize resistance value efficiently. The final results indicate the necessity of identifying a ground path for CM currents, and confirm the effectiveness of BS termination. Regarding the value of the involved resistors, it is proven that it should be defined based on the specific system configuration and application requirements, i.e., there is not a single optimal value applicable to all configurations. Accordingly, instead of a specific value, a range of optimal resistance values is proposed.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"940-948"},"PeriodicalIF":2.5000,"publicationDate":"2025-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10836952/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Bob Smith (BS) termination is usually adopted to terminate twisted wired pairs in order to reduce common mode (CM) interference, as suggested by Ethernet board design guidelines compliant with the 100BASE-TX standard. However, there is not a robust proof of the effectiveness of the specific component values for this termination. This article proposes a detailed analysis and design technique for the termination components that allow for effectively suppressing CM disturbance at the Ethernet board transmission driver ports. The focus is on the analysis of the CM reflection and differential-to- CM conversion. To this end, an equivalent circuit of the system is derived and characterized at the transmission ports by a suitably-reduced mixed-mode S-parameters matrix. Parametric analysis and multiobjective optimization are used to optimize resistance value efficiently. The final results indicate the necessity of identifying a ground path for CM currents, and confirm the effectiveness of BS termination. Regarding the value of the involved resistors, it is proven that it should be defined based on the specific system configuration and application requirements, i.e., there is not a single optimal value applicable to all configurations. Accordingly, instead of a specific value, a range of optimal resistance values is proposed.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.