Low-Complexity Near-Optimal Demodulation for Spatial Modulation Based on M-Algorithm

IF 5.5 3区 计算机科学 Q1 COMPUTER SCIENCE, INFORMATION SYSTEMS IEEE Wireless Communications Letters Pub Date : 2025-01-10 DOI:10.1109/LWC.2024.3486207
Jian Zheng;Yutai Sun;Huayi Zhou;Chuan Zhang
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Abstract

Spatial modulation (SM), renowned for its high energy efficiency, stands as a pivotal massive MIMO transmission technique. Leveraging the parallel processing capability and superior error rate performance, the M-algorithm to maximum likelihood (MML) algorithm has emerged as a competitive demodulation method for SM systems. In MML, judicious configuration of layer widths can effectively diminish complexity. Nevertheless, existing literature, to the best of our knowledge, relies on empirical settings for layer widths, lacking a formal optimization strategy. In this letter, we propose a layer width optimization algorithm based on mathematical analysis and Monte Carlo simulations. Numerical results have demonstrated that the MML algorithm coupled with our proposed layer width configuration method yields the symbol vector error rate (SVER) comparable to the state-of-the-art optimal demodulation, while achieving a noteworthy complexity reduction.
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基于m算法的空间调制低复杂度近最优解调
空间调制(SM)以其高能效而闻名,是一种关键的大规模MIMO传输技术。利用并行处理能力和优越的误码率性能,m -算法到最大似然(MML)算法已成为SM系统的一种有竞争力的解调方法。在MML中,明智地配置层宽度可以有效地降低复杂性。然而,据我们所知,现有文献依赖于层宽度的经验设置,缺乏正式的优化策略。在这封信中,我们提出了一种基于数学分析和蒙特卡罗模拟的层宽度优化算法。数值结果表明,MML算法与我们提出的层宽度配置方法相结合,产生的符号向量错误率(SVER)可与最先进的最优解调相媲美,同时显著降低了复杂性。
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来源期刊
IEEE Wireless Communications Letters
IEEE Wireless Communications Letters Engineering-Electrical and Electronic Engineering
CiteScore
12.30
自引率
6.30%
发文量
481
期刊介绍: IEEE Wireless Communications Letters publishes short papers in a rapid publication cycle on advances in the state-of-the-art of wireless communications. Both theoretical contributions (including new techniques, concepts, and analyses) and practical contributions (including system experiments and prototypes, and new applications) are encouraged. This journal focuses on the physical layer and the link layer of wireless communication systems.
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