2.5-dimensional topological superconductivity in twisted superconducting flakes

IF 6.2 1区 物理与天体物理 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY npj Quantum Materials Pub Date : 2025-01-27 DOI:10.1038/s41535-024-00719-2
Kevin P. Lucht, J. H. Pixley, Pavel A. Volkov
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Abstract

Multilayer flakes of two-dimensional materials were recently shown to be tunable by twisting monolayers on their surface. This raises the question whether qualitatively new phenomena can occur in such finite-thickness moiré systems. Here we demonstrate the emergence of distinct topological phases and transitions in N-layered flakes of nodal superconductors with a single monolayer twisted on top of it. We show that a c-axis current transforms the whole system into a chiral topological superconductor. Increasing the current drives a sequence of topological transitions between states characterized by a Chern number increasing from \(\sim {\mathcal{O}}(N)\) up to \(\sim {\mathcal{O}}({N}^{2})\), well beyond the additive effect of stacking N layers. We predict thickness-independent signatures of these states in the thermal Hall and tunneling microscopy measurements. Twisted superconductor flakes thus provide an example of a “2.5-dimensional” material where the synergy of two-dimensional layers extended in a third dimension realize states inaccessible in either monolayer or bulk materials.

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扭曲超导片的2.5维拓扑超导性
二维材料的多层薄片最近被证明可以通过扭曲其表面的单层来调节。这就提出了一个问题,即在这种有限厚度的流体系统中是否会出现定性的新现象。在这里,我们展示了n层节点超导体薄片中不同拓扑相和转变的出现,其顶部有一个单层扭曲。我们证明了c轴电流将整个系统转变为手性拓扑超导体。增加电流驱动了一系列以陈氏数从\(\sim {\mathcal{O}}(N)\)增加到\(\sim {\mathcal{O}}({N}^{2})\)为特征的状态之间的拓扑转变,远远超出了堆叠N层的加性效应。我们在热霍尔和隧道显微镜测量中预测了这些态的厚度无关特征。因此,扭曲超导体薄片提供了一个“2.5维”材料的例子,其中二维层的协同作用扩展到第三维,实现了单层或块状材料无法实现的状态。
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来源期刊
npj Quantum Materials
npj Quantum Materials Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
10.60
自引率
3.50%
发文量
107
审稿时长
6 weeks
期刊介绍: npj Quantum Materials is an open access journal that publishes works that significantly advance the understanding of quantum materials, including their fundamental properties, fabrication and applications.
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