Adhesive-less bonding of incompatible thermosetting materials†

Shhyam Khairkkar, Amol V. Pansare, Shubham V. Pansare, Shraddha Y. Chhatre, Junji Sakamoto, Michel Barbezat, Giovanni P. Terrasi, Vishwanath R. Patil, Amit A. Nagarkar and Masanobu Naito
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Abstract

We show that dynamic covalent exchange at the interface of two thermosetting polymers results in strong bonding between the materials via creation of a new material at the interface. Thus, polymers of significantly different polarities can be bonded without the use of adhesives. We also show that such dynamic covalent exchange is not only limited to the interface but also penetrates into the bulk material (ca. 20 microns), thereby creating a strong bond. The creation of a new material at the interface was confirmed by Energy Dispersive X-ray (EDX) elemental mapping as well as a new glass transition temperature at the interface. Using this phenomenon, we show that hydrophobic, compliant polymers can also be used as adhesives for polar, stiff materials. We also show that such dynamic exchange also takes place in the presence of fillers like nano-silica. Lastly, using this technique, we demonstrate the adhesive-less fabrication of layered materials where each layer has vastly different polarities and mechanical properties, thereby tuning the failures modes of the resulting composite material.

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Debondable phenoxy-based structural adhesives with β-amino amide containing reversible crosslinkers. Back cover Impact of aromatic to quinoidal transformation on the degradation kinetics of imine-based semiconducting polymers† Adhesive-less bonding of incompatible thermosetting materials† Polymer-based solid electrolyte interphase for stable lithium metal anodes†
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