A quantitative model to determine the Ti content for crack-free AlCuMg alloy in laser powder-bed fusion

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2025-01-31 DOI:10.1016/j.jmapro.2024.12.059
Ziqian Wang , Yuhan Qian , Yakai Xiao , Zijue Tang , Yi Wu , Hua Sun , Tengteng Sun , Xingtian Liu , Haowei Wang , Hongze Wang
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Abstract

A quantitative model for hot cracking prediction is essential for the composition design of non-castable AlCuMg alloys. In present work, the hot cracking prediction model of laser powder-bed fusion (LPBF) processed Ti-modified AlCuMg alloys was built on the basis of time-dependent nucleation theory and non-steady nucleation kinetics. The critical Ti content for crack-free AlCuMg alloy was calculated by this model and then manufactured successfully under the guidance of crack elimination strategy given by model simulation. The microstructure evolution of AlCuMg alloys with both inferior and superior Ti content to the critical value were investigated respectively in detail so that the effectiveness of model could be verified. The correlation among cooling rate, Ti content and Al3Ti nuclei density was quantified and analyzed so that the formation of hot-tearing cracks could be discussed combined with microstructure evolution and crack susceptibility criterion. This model is promising for simplifying composition design work of high-strength aluminum alloys and further giving guidance on parameter optimization for LPBF manufacturing of non-castable Al alloys.

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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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