Thermal imaging based non-destructive testing for fault detection in cold spray additive manufacturing

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2025-01-31 DOI:10.1016/j.jmapro.2024.12.065
Rohit Bokade, Sinan Müftü, Ozan Çağatay Özdemir, Xiaoning Jin
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Abstract

Cold spray is an advanced additive manufacturing technique where spray particles are accelerated through a supersonic nozzle for deposition onto a substrate. Variations in gas properties (e.g., temperature, pressure, mass flow rate) or nozzle conditions (e.g., wear or clogging) can lead to faults that affect the powder feed rate and deposition quality. These changes are reflected in the substrate’s temperature profile, which are monitored using thermal imaging. This study introduces ThermoAnoNet, a thermal image-based non-destructive testing (NDT) framework for detecting anomalies related to changes in gas dynamics or nozzle conditions. ThermoAnoNet forecasts the substrate’s temperature profile under normal conditions and detects anomalies by identifying deviations that indicate faults, such as increased deposition rates or nozzle clogging. The model, based on deep unsupervised learning, identifies temperature deviations that correlate with faults in the cold spray process. Experimental results show that ThermoAnoNet effectively detects anomalies with 90% accuracy, demonstrating its potential for real-time monitoring, minimizing defects, and enhancing the reliability of the cold spray process.

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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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