Achieving effective bonding between W-75Cu composite and CuCrZr alloy via spark plasma sintering

IF 2 3区 工程技术 Q1 NUCLEAR SCIENCE & TECHNOLOGY Fusion Engineering and Design Pub Date : 2025-02-01 Epub Date: 2025-01-03 DOI:10.1016/j.fusengdes.2024.114791
Changcheng Sang , Dang Xu , Kaichao Fu , Ruizhi Chen , Pengqi Chen , Yingwei Lu , Yonghong Xia , Qiu Xu , Jigui Cheng
{"title":"Achieving effective bonding between W-75Cu composite and CuCrZr alloy via spark plasma sintering","authors":"Changcheng Sang ,&nbsp;Dang Xu ,&nbsp;Kaichao Fu ,&nbsp;Ruizhi Chen ,&nbsp;Pengqi Chen ,&nbsp;Yingwei Lu ,&nbsp;Yonghong Xia ,&nbsp;Qiu Xu ,&nbsp;Jigui Cheng","doi":"10.1016/j.fusengdes.2024.114791","DOIUrl":null,"url":null,"abstract":"<div><div>In this study, spark plasma sintering (SPS) was employed to achieve the simultaneous sintering and bonding of W-75Cu composite with CuCrZr alloy. The effects of the sintering temperature on the microstructure evolution and properties of the W-75Cu/CuCrZr joints were systematically investigated and their thermal shock resistance was evaluated. The results indicated that a dense and defect-free joint was obtained at 950 °C, demonstrating the maximum shear strength (216.5 MPa) and thermal conductivity (237.9 W/(m·K)). Fracture analysis revealed that failure predominantly occurred within the W-75Cu matrix, confirming robust interfacial bonding. Additionally, after 200 thermal shock cycles at 450 °C-RT, the W-75Cu/CuCrZr joint maintained a high joint strength (172.7 MPa) without visible cracks on the interface, thereby demonstrating excellent joint reliability and thermal shock resistance. This study highlights the advantages of SPS technology in promoting the densification of the matrices and achieving high-performance joints, providing valuable technical insights for achieving a reliable bonding between the W-Cu FGM (high Cu content) and the CuCrZr heat sink material.</div></div>","PeriodicalId":55133,"journal":{"name":"Fusion Engineering and Design","volume":"211 ","pages":"Article 114791"},"PeriodicalIF":2.0000,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fusion Engineering and Design","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0920379624006410","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/1/3 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"NUCLEAR SCIENCE & TECHNOLOGY","Score":null,"Total":0}
引用次数: 0

Abstract

In this study, spark plasma sintering (SPS) was employed to achieve the simultaneous sintering and bonding of W-75Cu composite with CuCrZr alloy. The effects of the sintering temperature on the microstructure evolution and properties of the W-75Cu/CuCrZr joints were systematically investigated and their thermal shock resistance was evaluated. The results indicated that a dense and defect-free joint was obtained at 950 °C, demonstrating the maximum shear strength (216.5 MPa) and thermal conductivity (237.9 W/(m·K)). Fracture analysis revealed that failure predominantly occurred within the W-75Cu matrix, confirming robust interfacial bonding. Additionally, after 200 thermal shock cycles at 450 °C-RT, the W-75Cu/CuCrZr joint maintained a high joint strength (172.7 MPa) without visible cracks on the interface, thereby demonstrating excellent joint reliability and thermal shock resistance. This study highlights the advantages of SPS technology in promoting the densification of the matrices and achieving high-performance joints, providing valuable technical insights for achieving a reliable bonding between the W-Cu FGM (high Cu content) and the CuCrZr heat sink material.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
通过放电等离子烧结实现了W-75Cu复合材料与CuCrZr合金的有效结合
本研究采用火花等离子烧结(SPS)技术,实现了W-75Cu复合材料与CuCrZr合金的同时烧结和结合。系统研究了烧结温度对W-75Cu/CuCrZr接头组织演变和性能的影响,并对其抗热震性能进行了评价。结果表明:在950℃时,接头致密、无缺陷,抗剪强度达到216.5 MPa,导热系数达到237.9 W/(m·K);断裂分析显示,破坏主要发生在W-75Cu基体内部,证实了界面结合的坚固性。在450°C-RT温度下,经过200次热冲击循环后,W-75Cu/CuCrZr接头仍保持较高的接头强度(172.7 MPa),界面无明显裂纹,表现出良好的接头可靠性和抗热冲击性能。本研究突出了SPS技术在促进基体致密化和实现高性能接头方面的优势,为实现W-Cu FGM(高Cu含量)与CuCrZr散热器材料之间的可靠结合提供了有价值的技术见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Fusion Engineering and Design
Fusion Engineering and Design 工程技术-核科学技术
CiteScore
3.50
自引率
23.50%
发文量
275
审稿时长
3.8 months
期刊介绍: The journal accepts papers about experiments (both plasma and technology), theory, models, methods, and designs in areas relating to technology, engineering, and applied science aspects of magnetic and inertial fusion energy. Specific areas of interest include: MFE and IFE design studies for experiments and reactors; fusion nuclear technologies and materials, including blankets and shields; analysis of reactor plasmas; plasma heating, fuelling, and vacuum systems; drivers, targets, and special technologies for IFE, controls and diagnostics; fuel cycle analysis and tritium reprocessing and handling; operations and remote maintenance of reactors; safety, decommissioning, and waste management; economic and environmental analysis of components and systems.
期刊最新文献
Study of 4H-SiC detectors as a potential fast neutron diagnostic for fusion experiment Energy-based method for determining tensile properties of structural materials in fusion reactors using small-sized three-point bending specimens Thermal behaviour of ZrCo getter beds during hydrogen absorption at variable flow rates and concentrations Code-to-code comparison of SOLPS-ITER and SONIC edge transport codes in JT-60SA tokamak plasma conditions Theoretical background for a fast flow liquid metal divertor experiment
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1