In-situ monitoring of hole evolution process in ultrafast laser drilling using optical coherence tomography

IF 6.8 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2025-01-17 Epub Date: 2024-12-18 DOI:10.1016/j.jmapro.2024.12.020
Tao Sun, Wanqin Zhao, Zhengjie Fan, Jinge He, Peng Shen, Jianlei Cui, Xuesong Mei
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Abstract

In-situ monitoring and control of the drilling process are critical for achieving high-quality structure fabrication, optimizing the process, and gaining a deeper understanding of drilling dynamics. Optical coherence tomography (OCT), an advanced interferometric measurement technique, is now widely used for in-situ monitoring of depth information in laser welding or additive manufacturing. However, due to the complex trajectories and evolution dynamics of trepanning drilling, in-situ observation of hole evolution in ultrafast laser trepanning drilling of metals has not been realized. Here, we report a real-time monitoring technology for in-situ measurement of hole depth in ultrafast laser trepanning drilling using spectral-domain optical coherence tomography (SD-OCT). To achieve the position-synchronized acquisition of depth information, a position-encoded scanning method is proposed. Then the spatiotemporal correlation between the drilling process and the measurement results is systematically analyzed. Considering the spatial correlation and temporal continuity of laser drilling, a new method, called spatiotemporal correlation depth extraction (STC-DE) is first proposed to achieve the automatic, position synchronous in-situ measurement of hole depth in laser trepanning drilling. Finally, the effectiveness and generalization ability of this method are verified under different processing parameters. Experimental results demonstrate the measurement accuracy can reach micron level. This study fully presents the feasibility of SD-OCT in in-situ measurement of hole depth and real-time monitoring of hole evolution process in ultrafast laser drilling. It highlights the potential of this approach in revealing complex machining phenomena, optimizing processes, and achieving precise manufacturing control.
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光学相干层析成像技术在超快激光钻孔中孔演化过程的原位监测
钻井过程的现场监测和控制对于实现高质量的结构制造、优化工艺以及更深入地了解钻井动力学至关重要。光学相干层析成像(OCT)是一种先进的干涉测量技术,目前广泛用于激光焊接或增材制造中深度信息的原位监测。然而,由于钻孔轨迹和演化动力学的复杂性,金属超快激光钻孔过程中孔演化的现场观测尚未实现。本文报道了一种利用光谱域光学相干层析成像(SD-OCT)实时监测超快激光钻孔钻孔深度的技术。为了实现深度信息的位置同步获取,提出了一种位置编码扫描方法。然后系统分析了钻孔过程与测量结果的时空相关性。考虑到激光钻孔的空间相关性和时间连续性,首次提出了一种时空相关深度提取(STC-DE)新方法,以实现激光钻孔中孔深的自动、位置同步原位测量。最后,在不同的加工参数下验证了该方法的有效性和泛化能力。实验结果表明,测量精度可达到微米级。本研究充分证明了SD-OCT在超快激光钻孔中原位测量孔深和实时监测孔演化过程的可行性。它强调了这种方法在揭示复杂加工现象、优化工艺和实现精确制造控制方面的潜力。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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