Surface tension confined digital light processing for hydrogel printing with high availability

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2025-01-31 DOI:10.1016/j.jmapro.2025.01.086
Feng Xu , Hang Jin , Zhuomin Zhou , Acan Jiang , Lingling Liu , Haohang Fang , Qiang Gao , Yu-Chuan Su , Zhengmao Ding , Qinnan Chen , Songyue Chen , Daoheng Sun
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Abstract

Digital light processing (DLP) has emerged as one of the most promising methods for constructing intricate 3D hydrogel structures. However, the material availability of hydrogels is quite limited for resin vat-based printing. To overcome this issue, we propose a surface tension confined digital light processing (STC-DLP) technique that utilizes liquid surface tension and surface-treated substrates to confine the hydrogel solution during printing, to minimize the solution consumption. The “top-down” DLP printing enables layer-by-layer curing of hydrogel solutions into controlled 3D structures. A soft and a rigid hydrogel solution was selected as demonstration. By adding hydrogel solution with desired volume, highly accurate microtissue models, flexible sensors, and microfluidic chips with complex 3D structures were fabricated with high solution availability. This approach achieves efficient utilization of hydrogel solutions, and is expected to be especially applicable for printing of scarce or expensive materials.

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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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