Study of Photothermal Interactions in Semiconductor Media with Energy Dissipation

IF 0.6 4区 工程技术 Q4 MECHANICS Mechanics of Solids Pub Date : 2025-02-09 DOI:10.1134/S0025654424605494
Aatef Hobiny, Ibrahim Abbas
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引用次数: 0

Abstract

This study uses a novel model of photo-thermal and elastic wave with energy dissipation to calculate the temperature, stress, displacement, and carrier density in semiconductor media. The medium is taken into consideration when thermo-elastic waves and plasma are coupled. This study investigated the interactions between highly concentrated laser beams with varied intensity and the material’s thermal, elastic, and plasma waves. The eigenvalue scheme and Laplace transform is utilized to get the analytical full expressions of the most important phenomena. The analytical solutions generated by the eigenvalue technique in the altered domains were seen using Laplace transform methods. The numerical computations were performed using a semiconductor that looked like silicon.

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来源期刊
Mechanics of Solids
Mechanics of Solids 医学-力学
CiteScore
1.20
自引率
42.90%
发文量
112
审稿时长
6-12 weeks
期刊介绍: Mechanics of Solids publishes articles in the general areas of dynamics of particles and rigid bodies and the mechanics of deformable solids. The journal has a goal of being a comprehensive record of up-to-the-minute research results. The journal coverage is vibration of discrete and continuous systems; stability and optimization of mechanical systems; automatic control theory; dynamics of multiple body systems; elasticity, viscoelasticity and plasticity; mechanics of composite materials; theory of structures and structural stability; wave propagation and impact of solids; fracture mechanics; micromechanics of solids; mechanics of granular and geological materials; structure-fluid interaction; mechanical behavior of materials; gyroscopes and navigation systems; and nanomechanics. Most of the articles in the journal are theoretical and analytical. They present a blend of basic mechanics theory with analysis of contemporary technological problems.
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