Epoxy Binder Modifier Based on Epoxyphosphazene Resin

Abstract

The possibility of using epoxyphosphazene resin as a modifier for the epoxydiane matrix cured with 4,4-diaminodiphenylmethane has been studied. A dynamic mechanical analysis showed that with a modifier introduced in epoxydiane resin, the rubber elasticity modulus and the glass transition temperature increase relative to those of the unmodified matrix. The molecular mass between the crosslinks, calculated from the rubber elasticity modulus, decreases when epoxyphosphazene resin is introduced in the epoxydiane matrix, indicating an increase in the density of crosslinking in the modified systems. With an increase in the content of epoxyphosphazene resin in the binder, the impact viscosity of the composites increases compared to that of the unmodified matrix. The fragments of the three-dimensional network structure in such systems can be impact energy dissipators.