Investigation on Artificial Intelligence Hardware Architecture Design Based on Logic-in-Memory Ferroelectric Fin Field-Effect Transistor at Sub-3nm Technology Nodes

IF 6.1 Q1 AUTOMATION & CONTROL SYSTEMS Advanced intelligent systems (Weinheim an der Bergstrasse, Germany) Pub Date : 2024-09-04 DOI:10.1002/aisy.202400370
Changho Ra, Huijun Kim, Juhwan Park, Gwanoh Youn, Uyong Lee, Junsu Heo, Chester Sungchung Park, Jongwook Jeon
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Abstract

With the advancement of artificial intelligence and internet of things, logic-in-memory (LiM) technology has garnered attention. This article presents research on LiM utilizing ferroelectric fin field-effect transistor (FinFET). Herein, the LiM characteristics of FinFET with hafnia-based switchable ferroelectric gate stack applied to the sub-3 nm future technology node are analyzed. This analysis is extended to the system level and its characteristics are observed. A compact model of the ferroelectric capacitor using Verilog-A is developed and the operation of LiM circuits such as 1-bit full adder, ternary content-addressable memory, and flip-flop by combining FinFET characteristics based on atomistic simulation with fabricated silicon-doped hafnium oxide characteristics is analyzed. Furthermore, by applying these ferroelectric devices, a power consumption reduction of 85.2% in the convolutional neural network accelerator at the system level is observed.

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亚3nm技术节点下基于内存铁电翅片场效应晶体管的人工智能硬件架构设计研究
随着人工智能(ai)和物联网(iot)的发展,内存逻辑(logic-in-memory, LiM)技术备受关注。本文介绍了利用铁电翅片场效应晶体管(FinFET)实现LiM的研究。本文分析了应用于亚3nm未来技术节点的基于铪基可切换铁电栅极堆的FinFET的LiM特性。将此分析扩展到系统层面,并观察其特征。利用Verilog-A开发了一个紧凑的铁电电容器模型,并将基于原子模拟的FinFET特性与制备的掺硅氧化铪特性相结合,分析了1位全加法器、三元内容可寻址存储器和触发器等LiM电路的工作原理。此外,通过应用这些铁电器件,在系统级观察到卷积神经网络加速器的功耗降低了85.2%。
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