Comprehensive analysis of the forming zone and improvement of diameter reduction prediction in the dieless wire drawing process

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2025-02-18 DOI:10.1016/j.jmapro.2025.02.035
Merle Braatz , Jan Bohlen , Noomane Ben Khalifa
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引用次数: 0

Abstract

The main disadvantage of the dieless wire drawing process is the complex interdependence of the process parameters, which often leads to process instability. The objective of this paper is to integrate the analysis of material behaviour with process performance, thereby extending the range of applicability and enhancing process control. For this purpose, the forming zone and its length are investigated and evaluated in detail to identify stable process scenarios and to predict the occurrence of (non-)localised deformation and actual diameter reduction. It is found that elevated temperatures above about 0.6 times the melting temperature result in well localised deformation, whereas increasing the feeding speed or the reduction ratio increases the length of the forming zone. An equation is presented for calculating the length of the forming zone based on material properties and process settings. In addition, stable process conditions are given, including minimum forming zone lengths and maximum possible diameter reductions. Predictions of actual diameter reductions using different approaches are also presented.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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