An 8-bit 20.7 TOPS/W Multilevel Cell ReRAM Macro With ADC-Assisted Bit-Serial Processing

IF 5.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Journal of Solid-state Circuits Pub Date : 2025-02-21 DOI:10.1109/JSSC.2025.3540114
Justin M. Correll;Lu Jie;Seungheun Song;Seungjong Lee;Junkang Zhu;Wei Tang;Luke Wormald;Jack Erhardt;Nicolas Breil;Roger Quon;Deepak Kamalanathan;Siddarth Krishnan;Michael Chudzik;Wei D. Lu;Zhengya Zhang;Michael P. Flynn
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Abstract

Analog compute in memory (CIM) with multilevel cell (MLC) resistive random access memory (ReRAM) promises highly dense and efficient compute support for machine learning and scientific computing. This article introduces analog to digital converter (ADC)-assisted bit-serial processing for efficient, high-throughput compute. Bit-serial digital to analog converters (DACs) and 8-bit binary-weighted multicycle sampling (BWMCS) ADCs perform analog vector-matrix multiplication (VMM) on MLC-based crossbar arrays. A direct drive ${g}_{m}$ -boosted transimpedance amplifier (TIA) enables high-speed crossbar readout. We present a system on chip (SoC) prototype consisting of four self-contained ReRAM-based CIM macros and a reduced instruction set computer-five (RISC-V) host. The test chip is fabricated in 65 nm CMOS with foundry-integrated MLC ReRAM. We trained LeNet1 for handwritten digit classification and mapped the CNN weights differentially to 3-bit MLC ReRAM across multiple CIM macros. The classification accuracy loss is 1.6% when compared to the quantization-aware trained model. The measured raw and normalized peak efficiencies are 20.7 and 662 TOPS/W, respectively. The compute density is 8.4 TOPS/mm2.
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具有adc辅助位串行处理的8位20.7 TOPS/W多电平单元ReRAM宏
基于多层单元(MLC)电阻随机存取存储器(ReRAM)的内存模拟计算(CIM)为机器学习和科学计算提供了高密度和高效的计算支持。本文介绍了模数转换器(ADC)辅助位串行处理,以实现高效、高吞吐量的计算。位串行数模转换器(dac)和8位二进制加权多周期采样(BWMCS) adc在基于mlc的交叉棒阵列上执行模拟向量矩阵乘法(VMM)。直接驱动${g}_{m}$升压跨阻放大器(TIA)实现高速交叉条读出。我们提出了一个片上系统(SoC)原型,由四个独立的基于reram的CIM宏和一个精简指令集计算机五(RISC-V)主机组成。该测试芯片采用65nm CMOS和代工厂集成MLC ReRAM制造。我们训练LeNet1用于手写数字分类,并跨多个CIM宏将CNN权重不同地映射到3位MLC ReRAM。与量化感知训练模型相比,分类精度损失为1.6%。测量的原始和标准化峰值效率分别为20.7和662 TOPS/W。计算密度为8.4 TOPS/mm2。
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来源期刊
IEEE Journal of Solid-state Circuits
IEEE Journal of Solid-state Circuits 工程技术-工程:电子与电气
CiteScore
11.00
自引率
20.40%
发文量
351
审稿时长
3-6 weeks
期刊介绍: The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.
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