Study of the Relationship Between Electrical Conductivity, Batter–Crumb Transition, and Leavening Powders During the Ohmic Baking of Pound Cake

IF 3.5 3区 农林科学 Q3 ENGINEERING, CHEMICAL Journal of Food Process Engineering Pub Date : 2025-02-25 DOI:10.1111/jfpe.70034
Doina Crucean, Eugenia Ayebea Asamoah, Anthony Oge, Delphine Queveau, Olivier Rouaud, Alain Le-Bail, Patricia Le-Bail
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Abstract

Ohmic heating (OH) is a promising technology in the food industry, with electrical conductivity (EC) playing a crucial role in its effectiveness. This study aimed to correlate the evolution of EC during pound cake baking using OH with the degree of starch gelatinization (DSG) and assess the impact of two sodium acid pyrophosphate leavening acids—SAPP10 and SAPP40—on EC. Baking was conducted in a prototype OH cell, and EC was measured in two ways: during baking as a function of increasing temperature, and at specific baking times and temperatures at the cake center. The latter was measured using impedancemetry at room temperature and correlated with the DSG determined by differential scanning calorimetry. Key results showed a clear negative correlation between EC and the DSG in the center of the OH-baked cake. Specifically, as the DSG increased from 4% at 60°C to about 48% at 76°C, EC decreased from 390 μS/cm to approximately 89 μS/cm, respectively. Importantly, the addition of different baking powders did not significantly affect EC evolution. These findings suggest that the relationship between EC and starch gelatinization in cakes is influenced by moisture content and ion mobility during baking. This study highlights the potential of EC monitoring as a tool to track internal changes in cakes during the OH process, offering valuable insights into how baking conditions can influence final product characteristics like texture and quality.

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面饼欧姆烘烤过程中电导率、面饼-面包屑转变与膨松粉关系的研究
欧姆加热(OH)在食品工业中是一项很有前途的技术,电导率(EC)在其有效性中起着至关重要的作用。本研究旨在将OH烘烤磅饼过程中EC的演变与淀粉糊化程度(DSG)联系起来,并评估两种酸型焦磷酸钠膨松酸sapp10和sapp40对EC的影响。在原型OH电池中进行烘烤,并通过两种方式测量EC:烘烤过程中作为温度升高的函数,以及在特定烘烤时间和蛋糕中心温度下。后者在室温下用阻抗法测量,并与差示扫描量热法测定的DSG相关。关键结果显示,EC与oh -bake cake中心的DSG之间存在明显的负相关。当DSG从60℃时的4%增加到76℃时的48%时,EC分别从390 μS/cm下降到89 μS/cm左右。重要的是,不同发酵粉的添加对EC的演变没有显著影响。这些结果表明,蛋糕中EC与淀粉糊化的关系受烘焙过程中水分含量和离子迁移率的影响。这项研究强调了EC监测作为跟踪OH过程中蛋糕内部变化的工具的潜力,为烘焙条件如何影响最终产品的特征(如质地和质量)提供了有价值的见解。
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来源期刊
Journal of Food Process Engineering
Journal of Food Process Engineering 工程技术-工程:化工
CiteScore
5.70
自引率
10.00%
发文量
259
审稿时长
2 months
期刊介绍: This international research journal focuses on the engineering aspects of post-production handling, storage, processing, packaging, and distribution of food. Read by researchers, food and chemical engineers, and industry experts, this is the only international journal specifically devoted to the engineering aspects of food processing. Co-Editors M. Elena Castell-Perez and Rosana Moreira, both of Texas A&M University, welcome papers covering the best original research on applications of engineering principles and concepts to food and food processes.
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