{"title":"Low-Profile Self-Packaged Multimode SIW Antenna With Low-Loss Air-Bridge Interconnection","authors":"Jun-Zhe Zhao;Liang Zhou;Zi-Qi Zhang;Yin-Shan Huang;Cheng-rui Zhang","doi":"10.1109/LAWP.2024.3510570","DOIUrl":null,"url":null,"abstract":"This letter presents a design of a self-packaged multimode antenna at the W band. The modes of the aperture antenna are analyzed. An additive resonant mode is excited by introducing a radiation patch. A metal post is inserted in the resonance cavity to suppress an undesired mode. The multimode antenna is embedded in a silicon interposer with air bridge in wafer-level packaging. The insertion loss of the air bridge with coplanar waveguide with grounds (CPWGs) is measured. The proposed antenna is fabricated by using in-house silicon-based microelectromechanical systems (MEMS) photosensitive composite film fabrication process. The measured gain is 7 dBi at 92 GHz with an impedance bandwidth of 81.4 GHz to 109 GHz. The self-packaged antenna shows some advantages and can be further integrated with other components.","PeriodicalId":51059,"journal":{"name":"IEEE Antennas and Wireless Propagation Letters","volume":"24 3","pages":"636-640"},"PeriodicalIF":3.7000,"publicationDate":"2024-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Antennas and Wireless Propagation Letters","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10772408/","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract
This letter presents a design of a self-packaged multimode antenna at the W band. The modes of the aperture antenna are analyzed. An additive resonant mode is excited by introducing a radiation patch. A metal post is inserted in the resonance cavity to suppress an undesired mode. The multimode antenna is embedded in a silicon interposer with air bridge in wafer-level packaging. The insertion loss of the air bridge with coplanar waveguide with grounds (CPWGs) is measured. The proposed antenna is fabricated by using in-house silicon-based microelectromechanical systems (MEMS) photosensitive composite film fabrication process. The measured gain is 7 dBi at 92 GHz with an impedance bandwidth of 81.4 GHz to 109 GHz. The self-packaged antenna shows some advantages and can be further integrated with other components.
期刊介绍：
IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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