Component Level EM Emission Assessment and Management for RF Desensitization

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-03-10 DOI:10.1109/TEMC.2025.3539591
Xiangrui Su;Wenchang Huang;Junghee Cho;Joonki Paek;Chulsoon Hwang
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Abstract

Radio frequency (RF) desensitization is a common issue caused by high-speed components in modern electronic devices. Consequently, numerous studies have focused on characterizing and quantifying electromagnetic (EM) emission sources by using near field scanning to detect EM noise sources. However, before near field scanning, no predetermined threshold is available to quickly assess whether an EM noise source will pose RF desensitization risks in the receiving antenna. This article presents a method to optimize near field scanning settings through EM emission management analysis. Drawing on experience from numerous EM emission studies, we introduce an EM emission management procedure for two common noise sources: dipole-like noise sources and cavity noise sources. The scanning results of three practical examples are provided to validate the efficiency of the proposed EM emission management analysis.
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射频脱敏的元件级电磁发射评估与管理
射频(RF)脱敏是现代电子设备中由高速元件引起的常见问题。因此,许多研究都集中在利用近场扫描检测电磁噪声源来表征和量化电磁(EM)发射源。然而,在近场扫描之前,没有预先确定的阈值可以快速评估电磁噪声源是否会对接收天线造成射频脱敏风险。本文提出了一种通过电磁发射管理分析来优化近场扫描设置的方法。根据大量电磁发射研究的经验,我们介绍了两种常见噪声源的电磁发射管理程序:偶极子类噪声源和腔噪声源。给出了三个实例的扫描结果,验证了所提出的电磁发射管理分析的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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