Effect of casting moulds on grain morphology, mechanical and tribological properties of Sn–Cu alloy

Abstract

Due to environmental health concerns, the usage of toxic lead (Pb) based alloys in electronic applcations has been strictly banned. Thus, Pb-free solders are noted as potential alloys in electronic industries to replace Pb-based solders. Sn–Cu (Pb-free solder) alloy has attracted wide attention. However, investigations on the effect of cooling modes on tribological properties of tin–copper (Sn–Cu) solder are scant. Usually, the mode of solidification controls the grain structure of alloys and, hence, the mechanical properties. Better hardness (mechanical) and wear (tribological) properties are essential for the higher reliability of Sn–Cu alloy in real working applications, such as in aerospace avionics and electronic systems. Hence in the current research study, an effect of grain morphology, hardness and wear properties were assessed for the Sn–Cu alloy cooled in different moulds (copper and graphite around oil).