{"title":"COFA: counterfactual attention framework for trustworthy wafer map failure classification","authors":"Kaiyue Feng, Jia Wang, Chenke Yin, Andong Li","doi":"10.1007/s10489-025-06488-0","DOIUrl":null,"url":null,"abstract":"<div><p>Classifying wafer map failure pattern plays a crucial role in semiconductor manufacturing, as it can help identify the underlying cause of abnormalities, thus reducing production costs. Existing works have shown that deep learning methods have great advantages in recognizing failure patterns. However, recent studies mainly focus on utilizing attention mechanisms to pinpoint critical regions as salient features, while ignoring the imperceptible underlying features and the causal relationship between prediction results and attention. This paper introduces a model-agnostic classification framework that leverages counterfactual explanations to enhance attention. Our approach consists of two steps: counterfactual example generation (Explain) and attention-based classifier refinement (Reinforce). The counterfactual explainer is designed to identify key pixel-level features, the adjustment of which could lead to different predictions. These generated counterfactual examples reveal hidden causal factors in the classifier’s decision-making process. Then the classifier utilizes these pixel features as attention, conducting reliable classification under the guidance of counterfactual examples. Through extensive experiments on real-world datasets, we demonstrate the effectiveness of our proposed model. It achieves an accuracy of 98.125<span>\\(\\%\\)</span> in the defect classification task on the WM-811K dataset and 92.544<span>\\(\\%\\)</span> on the MixedWM38 dataset, outperforming state-of-the-art attention methods such as SENet, CBAM, and Vision Transformer by over 5%. Our results highlight the superiority of our approach and its potential for practical implementation in the semiconductor manufacturing domain.</p></div>","PeriodicalId":8041,"journal":{"name":"Applied Intelligence","volume":"55 7","pages":""},"PeriodicalIF":3.5000,"publicationDate":"2025-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Intelligence","FirstCategoryId":"94","ListUrlMain":"https://link.springer.com/article/10.1007/s10489-025-06488-0","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE","Score":null,"Total":0}
引用次数: 0
Abstract
Classifying wafer map failure pattern plays a crucial role in semiconductor manufacturing, as it can help identify the underlying cause of abnormalities, thus reducing production costs. Existing works have shown that deep learning methods have great advantages in recognizing failure patterns. However, recent studies mainly focus on utilizing attention mechanisms to pinpoint critical regions as salient features, while ignoring the imperceptible underlying features and the causal relationship between prediction results and attention. This paper introduces a model-agnostic classification framework that leverages counterfactual explanations to enhance attention. Our approach consists of two steps: counterfactual example generation (Explain) and attention-based classifier refinement (Reinforce). The counterfactual explainer is designed to identify key pixel-level features, the adjustment of which could lead to different predictions. These generated counterfactual examples reveal hidden causal factors in the classifier’s decision-making process. Then the classifier utilizes these pixel features as attention, conducting reliable classification under the guidance of counterfactual examples. Through extensive experiments on real-world datasets, we demonstrate the effectiveness of our proposed model. It achieves an accuracy of 98.125\(\%\) in the defect classification task on the WM-811K dataset and 92.544\(\%\) on the MixedWM38 dataset, outperforming state-of-the-art attention methods such as SENet, CBAM, and Vision Transformer by over 5%. Our results highlight the superiority of our approach and its potential for practical implementation in the semiconductor manufacturing domain.
晶圆图故障模式分类在半导体制造中起着至关重要的作用,因为它可以帮助识别异常的根本原因,从而降低生产成本。已有的研究表明,深度学习方法在识别故障模式方面具有很大的优势。然而,最近的研究主要集中在利用注意机制来确定关键区域作为显著特征,而忽略了难以察觉的潜在特征以及预测结果与注意之间的因果关系。本文介绍了一个模型不可知论的分类框架,利用反事实解释来提高注意力。我们的方法包括两个步骤:反事实示例生成(解释)和基于注意的分类器改进(强化)。反事实解释器旨在识别关键的像素级特征,调整这些特征可能导致不同的预测。这些生成的反事实例子揭示了分类器决策过程中隐藏的因果因素。然后,分类器利用这些像素特征作为注意力,在反事实样例的指导下进行可靠分类。通过对真实世界数据集的大量实验,我们证明了我们提出的模型的有效性。在WM-811K数据集和MixedWM38数据集上的缺陷分类任务中,它的准确率分别达到98.125 \(\%\)和92.544 \(\%\),比SENet、CBAM和Vision Transformer等最先进的注意力方法高出5个以上%. Our results highlight the superiority of our approach and its potential for practical implementation in the semiconductor manufacturing domain.
期刊介绍:
With a focus on research in artificial intelligence and neural networks, this journal addresses issues involving solutions of real-life manufacturing, defense, management, government and industrial problems which are too complex to be solved through conventional approaches and require the simulation of intelligent thought processes, heuristics, applications of knowledge, and distributed and parallel processing. The integration of these multiple approaches in solving complex problems is of particular importance.
The journal presents new and original research and technological developments, addressing real and complex issues applicable to difficult problems. It provides a medium for exchanging scientific research and technological achievements accomplished by the international community.