Advancing Thermal Management Technology for Power Semiconductors through Materials and Interface Engineering

Abstract

Power semiconductors and chips are essential in modern electronics, driving applications from personal devices and data centers to energy technologies, vehicles, and Internet infrastructure. However, efficient heat dissipation remains a critical challenge, directly affecting their performance, reliability, and lifespan. High-power electronics based on wide- and ultrawide-bandgap semiconductors can exhibit power densities exceeding 10 kW/cm², hundreds of times higher than digital electronics, posing significant thermal management challenges. Addressing this issue requires advanced materials and interface engineering, alongside a comprehensive understanding of materials physics, chemistry, transport dynamics, and various electronic, thermal, and mechanical properties.