Hyper-Heuristic Optimization Using Multifeature Fusion Estimator for PCB Assembly Lines With Linear-Aligned-Heads Surface Mounters

IF 10.5 1区 计算机科学 Q1 AUTOMATION & CONTROL SYSTEMS IEEE Transactions on Cybernetics Pub Date : 2025-04-23 DOI:10.1109/TCYB.2025.3556512
Guangyu Lu;Huijun Gao;Zhengkai Li;Xinghu Yu;Tong Wang;Jianbin Qiu;Juan J. Rodríguez-Andina
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Abstract

Printed circuit board assembly line scheduling (PCBALS) is a difficult task in the electronic industry for assembly lines using surface mounters, which is critical for production efficiency. This is a special type of line optimization problem that uses different allocation techniques, resulting in wide differences in assembly times between machines. This article proposes a hyper-heuristic optimizer embedded with a multifeature fusion ensemble estimator (HHO-MFEE) for PCBALS using linear-aligned-heads surface mounters. The objective and constraints of the problem are discussed, and a min-max integer model for small-scale problems is built. At the hyper-heuristic low level, seven data- and target-driven heuristics are presented for allocating components to different machines. Strategies for duplicated conditions with component types and placement points allocation are proposed to improve the applicability of the algorithm and the quality of the solution. An ensemble assembly time estimator that incorporates the coding of multifeatures, including estimated subobjectives, is proposed for evaluating the quality of the solution. Experimental results show that: 1) the gaps between the solution from HHO-MFEE and the optimal solution of the model are 3.44%~7.28% for small-scale data; 2) the proposed time estimator has higher accuracy than regression and heuristic-based ones, with mean absolute error of 2.01% and 3.43% for training and testing data, respectively; and 3) HHO-MFEE is better than other state-of-the-art algorithms, with average improvement of 7.21%~9.47%.
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基于多特征融合估计器的线性对准头表面贴片PCB装配线超启发式优化
印刷电路板装配线调度是电子工业中一个难题,对于使用表面贴装机的装配线来说,它对生产效率至关重要。这是一种特殊类型的生产线优化问题,它使用不同的分配技术,导致机器之间的装配时间存在很大差异。本文提出了一种嵌入多特征融合集成估计器(HHO-MFEE)的超启发式优化器,用于使用线性对准头表面贴片的pcb线路板。讨论了问题的目标和约束条件,建立了求解小尺度问题的最小-最大整数模型。在超启发式低级,提出了7种数据和目标驱动的启发式方法,用于将组件分配到不同的机器。为了提高算法的适用性和解的质量,提出了具有组件类型和放置点分配的重复条件策略。提出了一种集成装配时间估计器,该估计器结合了多特征的编码,包括估计的子目标,用于评估解决方案的质量。实验结果表明:1)对于小尺度数据,HHO-MFEE解与模型最优解之间的差距为3.44%~7.28%;2)与回归估计和启发式估计相比,所提时间估计精度更高,训练数据和测试数据的平均绝对误差分别为2.01%和3.43%;3) HHO-MFEE算法优于其他先进算法,平均提高7.21%~9.47%。
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来源期刊
IEEE Transactions on Cybernetics
IEEE Transactions on Cybernetics COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE-COMPUTER SCIENCE, CYBERNETICS
CiteScore
25.40
自引率
11.00%
发文量
1869
期刊介绍: The scope of the IEEE Transactions on Cybernetics includes computational approaches to the field of cybernetics. Specifically, the transactions welcomes papers on communication and control across machines or machine, human, and organizations. The scope includes such areas as computational intelligence, computer vision, neural networks, genetic algorithms, machine learning, fuzzy systems, cognitive systems, decision making, and robotics, to the extent that they contribute to the theme of cybernetics or demonstrate an application of cybernetics principles.
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