Debonding of ceramic brackets by Er:YAG laser.

Journal of Istanbul University Faculty of Dentistry Pub Date : 2016-04-01 eCollection Date: 2016-01-01 DOI:10.17096/jiufd.39114
Fidan Alakus Sabuncuoglu, Seyda Ersahan, Ergul Erturk
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引用次数: 11

Abstract

Purpose: The objective of the present study is to evaluate the effects of Er:YAG laser debonding of ceramic brackets on the bond strength and the amount of adhesive resin remnant.

Materials and methods: Twenty human mandibular incisors were randomly divided into two groups of 10 and polycrystalline ceramic brackets (Transcend series 6000, 3M Unitek, Monrovia, CA, USA) were bonded on enamel surfaces. Group 1 was the control group in which no laser application was performed prior to the shear bond strength (SBS) testing. In Group 2, Er:YAG was applied in 3W power for 6 seconds using the scanning method. The brackets were tested for SBS with an Instron universal testing machine and results were expressed in megapascals (MPa). The amount of adhesive remnant was evaluated with Adhesive Remnant Index (ARI). One-way analysis of variance and Tukey's post-hoc tests were used for statistical analysis.

Results: Mean ± standard deviation of SBS values in the control group was 13.42 ±1.23 MPa and 8.47 ±0.71 MPa in the Er:YAG group and this difference was statistically significant (p<0.05). The evaluation of ARI scores demonstrated more adhesive was left on the enamel surface with Er:YAG group.

Conclusion: 3W power Er:YAG laser application with the scanning method to polycrystalline ceramic brackets demonstrated lower bond strengths and higher ARI scores during the debonding procedure.

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陶瓷支架的Er:YAG激光脱粘。
目的:评价Er:YAG激光脱粘对陶瓷托槽粘接强度和残余粘接树脂量的影响。材料和方法:将20个人下颚门牙随机分为两组,每组10个,多晶陶瓷托槽(Transcend series 6000, 3M Unitek, Monrovia, CA, USA)粘接在牙釉质表面。第1组为对照组,在剪切粘合强度(SBS)测试之前不进行激光应用。在第二组中,Er:YAG以3W功率扫描6秒。用英斯特朗万能试验机对支架进行SBS测试,测试结果以兆帕斯卡(MPa)表示。用粘接残余指数(ARI)评价粘接残余量。统计分析采用单因素方差分析和Tukey事后检验。结果:对照组SBS值的平均±标准差为13.42±1.23 MPa, Er:YAG组SBS值的平均±标准差为8.47±0.71 MPa,差异有统计学意义(p)结论:3W功率Er:YAG激光扫描法应用于多晶陶瓷托槽,在脱粘过程中表现出较低的粘接强度和较高的ARI评分。
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