Determination of the full-field stress and displacement using photoelasticity and sampling moiré method in a 3D-printed model

IF 3.2 3区 工程技术 Q2 MECHANICS Theoretical and Applied Mechanics Letters Pub Date : 2022-11-01 DOI:10.1016/j.taml.2022.100380
Zhangyu Ren , Qi Zhang , Yang Ju , Huimin Xie
{"title":"Determination of the full-field stress and displacement using photoelasticity and sampling moiré method in a 3D-printed model","authors":"Zhangyu Ren ,&nbsp;Qi Zhang ,&nbsp;Yang Ju ,&nbsp;Huimin Xie","doi":"10.1016/j.taml.2022.100380","DOIUrl":null,"url":null,"abstract":"<div><p>The quantitative characterization of the full-field stress and displacement is significant for analyzing the failure and instability of engineering materials. Various optical measurement techniques such as photoelasticity, moiré and digital image correlation methods have been developed to achieve this goal. However, these methods are difficult to incorporate to determine the stress and displacement fields simultaneously because the tested models must contain particles and grating for displacement measurement; however, these elements will disturb the light passing through the tested models using photoelasticity. In this study, by combining photoelasticity and the sampling moiré method, we developed a method to determine the stress and displacement fields simultaneously in a three-dimensional (3D)-printed photoelastic model with orthogonal grating. Then, the full-field stress was determined by analyzing 10 photoelastic patterns, and the displacement fields were calculated using the sampling moiré method. The results indicate that the developed method can simultaneously determine the stress and displacement fields.</p></div>","PeriodicalId":46902,"journal":{"name":"Theoretical and Applied Mechanics Letters","volume":null,"pages":null},"PeriodicalIF":3.2000,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2095034922000605/pdfft?md5=425ac5fa9a5e329e7933efbe574a7b23&pid=1-s2.0-S2095034922000605-main.pdf","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Theoretical and Applied Mechanics Letters","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2095034922000605","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MECHANICS","Score":null,"Total":0}
引用次数: 1

Abstract

The quantitative characterization of the full-field stress and displacement is significant for analyzing the failure and instability of engineering materials. Various optical measurement techniques such as photoelasticity, moiré and digital image correlation methods have been developed to achieve this goal. However, these methods are difficult to incorporate to determine the stress and displacement fields simultaneously because the tested models must contain particles and grating for displacement measurement; however, these elements will disturb the light passing through the tested models using photoelasticity. In this study, by combining photoelasticity and the sampling moiré method, we developed a method to determine the stress and displacement fields simultaneously in a three-dimensional (3D)-printed photoelastic model with orthogonal grating. Then, the full-field stress was determined by analyzing 10 photoelastic patterns, and the displacement fields were calculated using the sampling moiré method. The results indicate that the developed method can simultaneously determine the stress and displacement fields.

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在3d打印模型中使用光弹性和采样法确定全场应力和位移
全场应力和位移的定量表征对于分析工程材料的破坏和失稳具有重要意义。为了实现这一目标,各种光学测量技术,如光弹性、红外和数字图像相关方法都得到了发展。然而,由于测试模型中必须包含颗粒和光栅进行位移测量,这些方法难以同时确定应力场和位移场;然而,这些元素会干扰通过光弹性测试模型的光。在本研究中,我们将光弹性和采样法相结合,开发了一种正交光栅三维打印光弹性模型中同时确定应力场和位移场的方法。然后,通过分析10张光弹性图确定了全场应力,并采用采样法计算了位移场。结果表明,该方法可以同时确定应力场和位移场。
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来源期刊
CiteScore
6.20
自引率
2.90%
发文量
545
审稿时长
12 weeks
期刊介绍: An international journal devoted to rapid communications on novel and original research in the field of mechanics. TAML aims at publishing novel, cutting edge researches in theoretical, computational, and experimental mechanics. The journal provides fast publication of letter-sized articles and invited reviews within 3 months. We emphasize highlighting advances in science, engineering, and technology with originality and rapidity. Contributions include, but are not limited to, a variety of topics such as: • Aerospace and Aeronautical Engineering • Coastal and Ocean Engineering • Environment and Energy Engineering • Material and Structure Engineering • Biomedical Engineering • Mechanical and Transportation Engineering • Civil and Hydraulic Engineering Theoretical and Applied Mechanics Letters (TAML) was launched in 2011 and sponsored by Institute of Mechanics, Chinese Academy of Sciences (IMCAS) and The Chinese Society of Theoretical and Applied Mechanics (CSTAM). It is the official publication the Beijing International Center for Theoretical and Applied Mechanics (BICTAM).
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