ELECTRODEPOSITION OF COPPER POWDER FROM MIXTURE SULPHATE –CHLORIDE ACIDIC SOLUTION

S. Jasim
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Abstract

This paper studies the preparation of Copper powder from Copper Sulphate aqueoussolution(CuSO4.5H2O), sulfuric acid (H2SO4) and copper chloride (CuCl2.2H2O)by usingthe process of electro-deposition. Process of Powder deposition have been investigated forcopper powder, it is a fine layer on cathode electrode by using the value of different fromcurrent densities (0.12, 0.14, 0.16, and 0.18) A/cm2.as it is noticed the weight of the powderrises with there is of current density. Diffractions of X-ray (XRD) revealed high crystallinityand pure copper powder not contain impurity or oxides. Size of the Crystallite has beenmeasured by Scherrer's Formula about (38.44 -43.161) nm. Optical microscopes haverevealed the particles of copper have dendritic shapes. The size of Particles analyzermeasured the size of a particle which is about (2.4 – 8.7) ?m.
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硫酸盐-氯化物混合酸性溶液电沉积铜粉的研究
研究了以硫酸铜水溶液(CuSO4.5H2O)、硫酸(H2SO4)和氯化铜(CuCl2.2H2O)为原料,采用电沉积法制备铜粉的工艺。利用电流密度(0.12、0.14、0.16、0.18)a /cm2的不同值,研究了铜粉在阴极电极上的粉末沉积过程。正如我们所注意到的,粉末的重量与电流密度有关。x射线衍射(XRD)分析表明,铜粉结晶度高,纯度高,不含杂质和氧化物。用谢勒公式测定了晶体的尺寸,约为(38.44 -43.161)nm。光学显微镜显示铜的颗粒呈枝晶状。颗粒分析仪测量的颗粒大小约为(2.4 - 8.7)?m。
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审稿时长
24 weeks
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