The effect of tool wear on the damaged layer thickness and tool wear rate in ultra-precision turning of quartz glass

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Micromechanics and Microengineering Pub Date : 2023-07-26 DOI:10.1088/1361-6439/acea8b
Yujie Liu, H. Tong, Yong Li, Jialong Chen
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Abstract

Quartz glasses have been extensively used for many fields, such as semiconductor technology, optical instruments, inertial navigation and others. Ultra-precision turning with diamond tools can achieve high surface accuracy when processing non-ferrous materials. In recent years, ultra-precision turning has also been tried to be applied to process brittle materials, but there are constraints including small removal amount and tool wear. When diamond tools are used to cut quartz glass, tool wear occurs under the combined action of thermal effect and mechanical friction, which will affect the damaged layer thickness of the processed quartz glass. In this paper, the tool wear factor is led into the calculation of the extrusion volume, and the damaged layer thickness is calculated by the extrusion volume. Combined with the results of quartz glass turning experiments and the calculated results by simulation, the effect of tool wear factor on the damaged layer thickness and the tool wear rate is analyzed. The analysis shows that tool wear will lead to chip fracture thickness decrease and extrusion volume increase. Combined action of these two aspects, the damage layer thickness keeps unchanged at first and then rises with the increase of tool wear. In addition, the experimental results show that the tool wear rate rises with the increase of tool wear.
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超精密车削石英玻璃时刀具磨损对损伤层厚度和刀具磨损率的影响
石英玻璃在半导体技术、光学仪器、惯性导航等领域有着广泛的应用。在加工有色金属材料时,使用金刚石工具进行超精密车削可以实现高表面精度。近年来,超精密车削也被尝试应用于脆性材料的加工,但存在去除量小和刀具磨损等限制。金刚石刀具在切割石英玻璃时,在热效应和机械摩擦的共同作用下,刀具磨损会影响加工后石英玻璃的损伤层厚度。本文将刀具磨损因子引入挤压体积的计算中,并通过挤压体积计算损伤层厚度。结合石英玻璃车削实验结果和模拟计算结果,分析了刀具磨损因素对损伤层厚度和刀具磨损率的影响。分析表明,刀具磨损会导致切屑断裂厚度减小,挤压体积增大。在这两个方面的共同作用下,随着刀具磨损的增加,损伤层厚度先保持不变,然后上升。此外,实验结果表明,刀具磨损率随着刀具磨损的增加而增加。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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