The Effect of Water on the Tin Electrodeposition from [Bmim]HSO4 Ionic Liquid

IF 2 Q3 ELECTROCHEMISTRY International journal of electrochemistry Pub Date : 2018-08-09 DOI:10.1155/2018/1210394
Jie Tang, Dongliang Lv, Cunying Xu, Y. Hua, Qibo Zhang, PingZhao Niu, Xiaolin Zhu
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引用次数: 3

Abstract

The electrodeposition of tin from SnO in ionic liquid 1-butyl-3-methylimidazolium hydrogen sulfate ([Bmim]HSO4) in the presence of water at different cathodic potential was investigated. With the addition of water to [Bmim]HSO4ionic liquid, the electrochemical window of the electrolyte decreases and the reduction potential of Sn(II) positively shifts. The water content of ionic liquid electrolyte has a distinct effect on morphology of the deposits. As water content increased from 0 to 50% (v/v), the morphology of deposits varies from granular to hexagonal rod-like, then to hollow tubular, and finally to wire-like. The XRD phase analysis showed that both Sn and CuSn alloys were deposited in ionic liquid/water mixtures. However, in dried ionic liquids only Cu3Sn was obtained, surprisingly. The difference in the structure might be attributed to the various interactions of the ions with the Cu substrate. In addition, the deposition potential was found to play a significant role in the morphology of deposits.
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水对[Bmim]HSO4离子液体电沉积锡的影响
研究了离子液体1-丁基-3-甲基咪唑硫酸氢([Bmim]HSO4)在不同阴极电位条件下由SnO电沉积锡的过程。随着[Bmim] hso4离子液体中水的加入,电解质的电化学窗口减小,Sn(II)的还原电位正向移动。离子液体电解质的含水量对镀层的形貌有明显的影响。随着含水率从0增加到50% (v/v),沉积物的形貌由粒状到六角形棒状,再到空心管状,最后到线状。XRD物相分析表明,Sn和CuSn合金均沉积在离子液体/水混合物中。然而,令人惊讶的是,在干燥的离子液体中只得到Cu3Sn。这种结构上的差异可能是由于离子与Cu衬底的各种相互作用。此外,沉积电位对沉积物的形态也起着重要作用。
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