Study on the material removal mechanism of glass in single diamond grain grinding with ultrasonic vibration assisted

Abstract

The ultrasonic vibration assisted grinding is widely used in machining of hard and brittle material. This paper presents a study on the material removal mechanism in ultrasonic vibration assisted grinding of glass. The single diamond grain grinding experiments were performed with and without ultrasonic vibration assisted. The grinding force and acoustic emission signal were measured and analysed, and the ground groove morphology was observed and analysed in detail. The following conclusions can be obtained: 1) the material removal mechanism is changed from continuous crack propagation in conventional grinding to micro crack breakage in ultrasonic vibration assisted grinding; 2) the addition of ultrasonic vibration in grinding of brittle material can reduce the crack propagation distance; 3) compared with the conventional grinding, the energy distribution of acoustic emission signal in ultrasonic vibration assisted grinding is more concentrated.