Investigation of polishing parameters and slurry composition on germanium chemical mechanical planarisation using response surface methodology

IF 0.5 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY International Journal of Materials & Product Technology Pub Date : 2021-06-21 DOI:10.1504/ijmpt.2021.115823
Apeksha Gupta, Karthik Shathiri, Vidyasagar Shilapuram, M. Ramachandran
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Abstract

Chemical mechanical polishing/planarisation (CMP) stays a widely used process for complete planarisation in semiconductor fabrication. CMP process provides surface uniformity, high selectivity, low defects with the desired material removal rate. The removal rate is influenced by various independent parameters namely turntable speed, down pressure, slurry pH, and H2O2 concentration. Modelling the CMP process from fundamental principles is limited. Hence, in this study, the design of the experimental methodology has been adopted to design the CMP process. Different models such as linear, quadratic, two-factor interaction, and cubic mathematical were developed and statistically analysed in identifying the suitable model by Box-Behnken design. The consequence of each parameter and their interactions on Ge removal rate is analysed. A quadratic model is proposed from the outcome. The predicted values achieved using model equations exhibited appropriate fit by experimental values (R2 value for rutile and anatase as 0.943 and 0.942, respectively). The present work verified that response surface methodology and Box-Behnken design can be expeditiously functional for modelling of chemical mechanical planarisation.
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用响应面法研究锗化学机械抛光工艺参数及抛光浆成分
化学机械抛光/平面化(CMP)仍然是半导体制造中广泛使用的完全平面化工艺。CMP工艺提供了具有所需材料去除率的表面均匀性、高选择性、低缺陷。去除率受各种独立参数的影响,即转盘速度、下降压力、浆料pH和H2O2浓度。从基本原理对CMP过程进行建模是有限的。因此,在本研究中,采用了实验方法的设计来设计CMP工艺。开发了不同的模型,如线性、二次、双因素相互作用和三次数学模型,并通过Box-Behnken设计对其进行了统计分析,以确定合适的模型。分析了各参数及其相互作用对锗去除率的影响。根据结果提出了一个二次模型。使用模型方程获得的预测值显示出与实验值的适当拟合(金红石和锐钛矿的R2值分别为0.943和0.942)。目前的工作验证了响应面方法和Box-Behnken设计可以快速用于化学机械平面化的建模。
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来源期刊
International Journal of Materials & Product Technology
International Journal of Materials & Product Technology 工程技术-材料科学:综合
CiteScore
0.80
自引率
0.00%
发文量
61
审稿时长
8 months
期刊介绍: The IJMPT is a refereed and authoritative publication which provides a forum for the exchange of information and ideas between materials academics and engineers working in university research departments and research institutes, and manufacturing, marketing and process managers, designers, technologists and research and development engineers working in industry.
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