Christoph Winkler, Ulrich Schwarz, Johannes Konnerth
{"title":"Effect of thermal postcuring on the micro- and macromechanical properties of polyurethane for wood bonding","authors":"Christoph Winkler, Ulrich Schwarz, Johannes Konnerth","doi":"10.1186/s40563-018-0106-3","DOIUrl":null,"url":null,"abstract":"<p>The optimization of mechanical properties of adhesive bonds is of interest especially in structural applications. Besides transferring stresses, bondlines can also provide additional functionality, such as measuring deformations in structural timber applications by electrically conductive adhesives. This study investigates the influence of a thermal postcure treatment of polyurethane bonded wood joints. Bonded beech wooden samples were manufactured with three adhesives—a commercial one-component polyurethane for structural laminated timber and two modified ones, filled with electrically conductive particles. Adhesive bonds were subjected to a subsequent postcuring at 80 and 95?°C for 1 and 48?h, respectively. Mechanical properties of the bonds were studied on the macroscopic level by tensile shear tests and the properties of the cured adhesive on the microscopic level by nanoindentation. As a result, the tensile shear strength slightly dropped with addition of filler, while all specimens still fulfilled the requirement of EN 302-1 in dry condition. Nanoindentation revealed minor decreases in mechanical properties of the cured adhesive with postcuring time for two adhesives and a different reaction of carbon black filled polyurethane, as the creep factor decreases with the thermal postcure.</p>","PeriodicalId":464,"journal":{"name":"Applied Adhesion Science","volume":"6 1","pages":""},"PeriodicalIF":1.6800,"publicationDate":"2018-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1186/s40563-018-0106-3","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Adhesion Science","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1186/s40563-018-0106-3","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Dentistry","Score":null,"Total":0}
引用次数: 8
Abstract
The optimization of mechanical properties of adhesive bonds is of interest especially in structural applications. Besides transferring stresses, bondlines can also provide additional functionality, such as measuring deformations in structural timber applications by electrically conductive adhesives. This study investigates the influence of a thermal postcure treatment of polyurethane bonded wood joints. Bonded beech wooden samples were manufactured with three adhesives—a commercial one-component polyurethane for structural laminated timber and two modified ones, filled with electrically conductive particles. Adhesive bonds were subjected to a subsequent postcuring at 80 and 95?°C for 1 and 48?h, respectively. Mechanical properties of the bonds were studied on the macroscopic level by tensile shear tests and the properties of the cured adhesive on the microscopic level by nanoindentation. As a result, the tensile shear strength slightly dropped with addition of filler, while all specimens still fulfilled the requirement of EN 302-1 in dry condition. Nanoindentation revealed minor decreases in mechanical properties of the cured adhesive with postcuring time for two adhesives and a different reaction of carbon black filled polyurethane, as the creep factor decreases with the thermal postcure.
期刊介绍:
Applied Adhesion Science focuses on practical applications of adhesives, with special emphasis in fields such as oil industry, aerospace and biomedicine. Topics related to the phenomena of adhesion and the application of adhesive materials are welcome, especially in biomedical areas such as adhesive dentistry. Both theoretical and experimental works are considered for publication. Applied Adhesion Science is a peer-reviewed open access journal published under the SpringerOpen brand. The journal''s open access policy offers a fast publication workflow whilst maintaining rigorous peer review process.