Ruidong Luo , Xiaoli Yu , Zhen Wu , Hao Zhang , Zhi-Quan Liu , Katsuaki Suganuma , Cai-Fu Li
{"title":"Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment","authors":"Ruidong Luo , Xiaoli Yu , Zhen Wu , Hao Zhang , Zhi-Quan Liu , Katsuaki Suganuma , Cai-Fu Li","doi":"10.1016/j.mlblux.2022.100124","DOIUrl":null,"url":null,"abstract":"<div><p>Silver paste is supposed to be a most prospective die-attach material for power electronics. While, the bonding of silver paste with aluminum substrate cannot be easily achieved due to the native oxidation of aluminum. This work provides a direct bonding of aluminum with silver micro flake-based paste under 250℃ with a shear strength of 15 MPa with a propriate surface treatment method of aluminum, and the shear strength even keeps higher than 15 MPa after storing at 250℃for 1000 h. The bonding mechanism was elucidated with high resolution transmission electron microcopy. The results indicate a new route for the wide application of Al based substrate in power electronic with low cost.</p></div>","PeriodicalId":18245,"journal":{"name":"Materials Letters: X","volume":"13 ","pages":"Article 100124"},"PeriodicalIF":2.2000,"publicationDate":"2022-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590150822000047/pdfft?md5=3ca794255a7b1bdd53d76ddf7355ddbe&pid=1-s2.0-S2590150822000047-main.pdf","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters: X","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2590150822000047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 2
Abstract
Silver paste is supposed to be a most prospective die-attach material for power electronics. While, the bonding of silver paste with aluminum substrate cannot be easily achieved due to the native oxidation of aluminum. This work provides a direct bonding of aluminum with silver micro flake-based paste under 250℃ with a shear strength of 15 MPa with a propriate surface treatment method of aluminum, and the shear strength even keeps higher than 15 MPa after storing at 250℃for 1000 h. The bonding mechanism was elucidated with high resolution transmission electron microcopy. The results indicate a new route for the wide application of Al based substrate in power electronic with low cost.
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