Sufeng Wei, Xinming Hu, Xianglei Liu, Guoyong Wang
{"title":"Stabilization of Nanocrystalline Copper by Tantalum Grain Boundary Segregation","authors":"Sufeng Wei, Xinming Hu, Xianglei Liu, Guoyong Wang","doi":"10.4236/ojpc.2021.113009","DOIUrl":null,"url":null,"abstract":"Nanocrystalline Cu-Ta alloy films were deposited on glass slides by \nmagnetron sputtering. Microstructure characterization proved that most of the tantalum \natoms are segregated in the grain boundaries. Nanoindentation creep \nmeasurements were performed on it to uncover the stability mechanism of grain \nboundary segregation on nanocrystalline materials. It is found that segregation \ncan effectively slow down the creep strain rate and the grain boundary \nactivities. The suppressed grain boundary activities endow the alloy with a \nstable microstructure during plastic deformation and annealing.","PeriodicalId":59839,"journal":{"name":"物理化学期刊(英文)","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"物理化学期刊(英文)","FirstCategoryId":"1089","ListUrlMain":"https://doi.org/10.4236/ojpc.2021.113009","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Nanocrystalline Cu-Ta alloy films were deposited on glass slides by
magnetron sputtering. Microstructure characterization proved that most of the tantalum
atoms are segregated in the grain boundaries. Nanoindentation creep
measurements were performed on it to uncover the stability mechanism of grain
boundary segregation on nanocrystalline materials. It is found that segregation
can effectively slow down the creep strain rate and the grain boundary
activities. The suppressed grain boundary activities endow the alloy with a
stable microstructure during plastic deformation and annealing.
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