{"title":"Thermographic network identification for transient thermal heat path analysis","authors":"Nils J. Ziegeler, P. Nolte, S. Schweizer","doi":"10.1080/17686733.2022.2033529","DOIUrl":null,"url":null,"abstract":"ABSTRACT In this work, an evaluation method for transient thermal measurements is presented. It allows for a high temporal sensitivity by analysing the spectral composition of a thermal transient, the so-called time constant spectrum. The spectral components provide a detailed insight into the heat flow dynamics and thermal parameters describing a multi-layer system. The method is based on a one-dimensional heat path analysis technique common for the thermal characterisation of electronic components, called ‘network identification by deconvolution’. Here, a generalisation, called ‘thermographic network identification’, is presented to obtain spatially resolved thermal equivalence networks as complete thermal model of the device under study. As a proof of concept, two samples are investigated. The method is discussed on the basis of the obtained results.","PeriodicalId":54525,"journal":{"name":"Quantitative Infrared Thermography Journal","volume":"20 1","pages":"93 - 105"},"PeriodicalIF":3.7000,"publicationDate":"2022-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Quantitative Infrared Thermography Journal","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1080/17686733.2022.2033529","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
引用次数: 2
Abstract
ABSTRACT In this work, an evaluation method for transient thermal measurements is presented. It allows for a high temporal sensitivity by analysing the spectral composition of a thermal transient, the so-called time constant spectrum. The spectral components provide a detailed insight into the heat flow dynamics and thermal parameters describing a multi-layer system. The method is based on a one-dimensional heat path analysis technique common for the thermal characterisation of electronic components, called ‘network identification by deconvolution’. Here, a generalisation, called ‘thermographic network identification’, is presented to obtain spatially resolved thermal equivalence networks as complete thermal model of the device under study. As a proof of concept, two samples are investigated. The method is discussed on the basis of the obtained results.
期刊介绍:
The Quantitative InfraRed Thermography Journal (QIRT) provides a forum for industry and academia to discuss the latest developments of instrumentation, theoretical and experimental practices, data reduction, and image processing related to infrared thermography.