The influence of the ageing temperature on different properties of the EN AW-7075 aluminium alloy

IF 0.6 4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Revista De Metalurgia Pub Date : 2023-04-27 DOI:10.3989/revmetalm.238
Uroš Stamenković, S. Ivanov, I. Marković, M. Gorgievski, Kristina Božinović, Avram Kovačević
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Abstract

The influence of the ageing temperature on the hardness, electrical conductivity, thermal diffusivity and thermal conductivity of the EN AW-7075 aluminium alloy was studied in this paper. After solution treating the alloy at 480 °C for 1 h and quenching it in ice water, the investigated alloy was characterized using Differential Thermal Analysis (DTA) in order to determine the optimal temperatures for the isochronal ageing treatments. Afterwards, isochronal ageing was conducted at the temperature range of 110 °C-250 °C for 30 min The hardness, electrical conductivity, thermal diffusivity, thermal conductivity and microstructural features were investigated during the ageing treatments. Hardness had a peak value after ageing at 150 °C, while other properties gradually increased with the ageing temperature. Microstructural investigation of the aged alloy by SEM-EDS revealed the existence of precipitated phases that appear homogenously distributed in the microstructure.
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时效温度对EN AW-7075铝合金各项性能的影响
研究了时效温度对EN AW-7075铝合金硬度、电导率、热扩散系数和导热系数的影响。在480°C下对合金进行固溶处理1小时并在冰水中淬火后,使用差热分析(DTA)对所研究的合金进行表征,以确定等时时效处理的最佳温度。然后,在110°C-250°C的温度范围内进行等时老化30分钟。在老化处理过程中,研究了硬度、电导率、热扩散率、热导率和微观结构特征。硬度在150°C时效后达到峰值,而其他性能随着时效温度的升高而逐渐增加。通过SEM-EDS对时效合金的微观结构研究表明,存在均匀分布在微观结构中的沉淀相。
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来源期刊
Revista De Metalurgia
Revista De Metalurgia 工程技术-冶金工程
CiteScore
1.30
自引率
25.00%
发文量
18
审稿时长
>12 weeks
期刊介绍: Revista de Metalurgia is a bimonhly publication. Since 1998 Revista de Metalurgia and Revista Soldadura have been combined in a single publicación that conserves the name Revista de Metalurgia but also includes welding and cutting topics. Revista de Metalurgia is cited since 1997 in the ISI"s Journal of Citation Reports (JCR) Science Edition, and in SCOPUS.
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