{"title":"Introduction","authors":"S. Chase","doi":"10.1353/scs.2022.0030","DOIUrl":null,"url":null,"abstract":"In 1952 ASTM Committee D-14 sponsored a symposium on \"Testing Adhesives for Durability and Permanence.\" Several of the reasons for holding the previous symposium apply for the present symposium on \"The Durability of Adhesive Joints\": 1. Adhesive users want to know how long an adhesive will perform satisfactorily in a given use. 2. Many adhesives now being used have been developed in recent years so that insufficient data are available as to their durability in various uses. 3. Accelerated tests for durability are important to the resin manufacturer, the formulator, and the end user for efficient development of improved adhesives. Relatively recently it has been recognized that the combined effects of stress and moisture reduce drastically the durability of many structural adhesive joints. The aim of this symposium is to present new test methods and data on the durability of adhesive joints, as well as some general ways to treat durability data in order to determine approximate reliability of adhesive joints. Hopefully this symposium will lead to new standard test methods and to a stimulation of scientists and technologists to develop new theories and tests for the durability of adhesive joints. The symposium committee consisted of the following: G. F. Carter, E. I. du Pont de Nemours & Co., Inc., chairman; N. J. DeLollis, Sandia Corp.; R. M. Kell, Battelle Memorial Inst.; R. E. Kreibich, Weyerhaeuser Co.; M. Petronio, Frankford Arsenal; and L. H. Sharpe, Bell Telephone Co.","PeriodicalId":42348,"journal":{"name":"Spiritus-A Journal of Christian Spirituality","volume":"22 1","pages":"153 - 156"},"PeriodicalIF":0.1000,"publicationDate":"2022-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Spiritus-A Journal of Christian Spirituality","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1353/scs.2022.0030","RegionNum":4,"RegionCategory":"哲学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"0","JCRName":"RELIGION","Score":null,"Total":0}
引用次数: 0
Abstract
In 1952 ASTM Committee D-14 sponsored a symposium on "Testing Adhesives for Durability and Permanence." Several of the reasons for holding the previous symposium apply for the present symposium on "The Durability of Adhesive Joints": 1. Adhesive users want to know how long an adhesive will perform satisfactorily in a given use. 2. Many adhesives now being used have been developed in recent years so that insufficient data are available as to their durability in various uses. 3. Accelerated tests for durability are important to the resin manufacturer, the formulator, and the end user for efficient development of improved adhesives. Relatively recently it has been recognized that the combined effects of stress and moisture reduce drastically the durability of many structural adhesive joints. The aim of this symposium is to present new test methods and data on the durability of adhesive joints, as well as some general ways to treat durability data in order to determine approximate reliability of adhesive joints. Hopefully this symposium will lead to new standard test methods and to a stimulation of scientists and technologists to develop new theories and tests for the durability of adhesive joints. The symposium committee consisted of the following: G. F. Carter, E. I. du Pont de Nemours & Co., Inc., chairman; N. J. DeLollis, Sandia Corp.; R. M. Kell, Battelle Memorial Inst.; R. E. Kreibich, Weyerhaeuser Co.; M. Petronio, Frankford Arsenal; and L. H. Sharpe, Bell Telephone Co.
1952年,ASTM D-14委员会主办了一个关于“测试胶粘剂的耐久性和持久性”的研讨会。举办上一次研讨会的几个原因适用于本次关于“胶粘剂接头的耐久性”的会议:1。粘合剂使用者想知道粘合剂在给定的使用中能令人满意地使用多久。2.近年来开发了许多目前使用的粘合剂,因此没有足够的数据表明它们在各种用途中的耐久性。3.耐久性的加速测试对于树脂制造商、配方制定者和最终用户有效开发改进的粘合剂非常重要。最近人们已经认识到,应力和湿度的综合作用大大降低了许多结构胶接接头的耐久性。本次研讨会的目的是介绍关于粘接接头耐久性的新测试方法和数据,以及处理耐久性数据的一些通用方法,以确定粘接接头的大致可靠性。希望这次研讨会将带来新的标准测试方法,并激励科学家和技术人员开发新的理论和测试方法,以提高粘接接头的耐久性。专题讨论会委员会由以下人员组成:G.F.Carter,E.I.du Pont de Nemours&Co.,股份有限公司董事长;N.J.DeLollis,桑迪亚公司。;R.M.Kell,巴特尔纪念学院。;R.E.Kreibich,Weyerhaeuser公司。;M.Petronio,弗兰克福德阿森纳;以及贝尔电话公司的L.H.夏普。