Advanced remote laser cutting of battery foils using an interference approach

IF 2.2 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters: X Pub Date : 2022-06-01 DOI:10.1016/j.mlblux.2022.100138
Robert Baumann , Sabri Alamri , Alfredo I. Aguilar-Morales , Andrés F. Lasagni , Tim Kunze
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引用次数: 1

Abstract

This work demonstrates how an interference pattern can improve the performance of remote laser cutting of pure copper foils, making the cutting process effective even for a low power laser source. The proof of concept is carried out by using a nanosecond laser source with a pulse duration of 5 ns, coupled with a two-beam scanning interference setup, producing a spatial period of 12.5 µm. In the experiments, processing parameters as pulse-to-pulse distance, laser power and scanning speed are varied, to optimize the foil breakthrough and their effect on the generated material modifications are investigated. A comparison between the processing results employing the interference pattern and single beam with a Gaussian energy distribution is carried out. While the single beam process is not sufficient for cutting a 10 µm thin metallic foil, the interference treatment shows an improvement over 100%. In addition, only small spatter formations are detected, with average particle sizes of 1.75 ± 0.82 µm on the top side of the foil. The bottom side of a fully separated copper foil only depicts small spatter formations of less than 1 µm.

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采用干涉方法的先进远程激光切割电池箔
这项工作展示了干涉图案如何提高纯铜箔的远程激光切割性能,使切割过程即使在低功率激光源下也有效。概念验证是通过使用脉冲持续时间为5 ns的纳秒激光源,再加上双光束扫描干扰装置,产生12.5 μ m的空间周期来进行的。在实验中,通过改变脉冲距离、激光功率和扫描速度等工艺参数来优化箔的突破,并研究了它们对生成材料改性的影响。对采用干涉图样处理的结果与采用高斯能量分布的单光束处理结果进行了比较。虽然单光束工艺不足以切割10 μ m薄的金属箔,但干涉处理显示出超过100%的改善。此外,仅检测到微小的飞溅形成,在箔的顶部平均粒径为1.75±0.82µm。完全分离的铜箔底部只会出现小于1 μ m的小飞溅。
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CiteScore
3.10
自引率
0.00%
发文量
50
审稿时长
114 days
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