Robert Baumann , Sabri Alamri , Alfredo I. Aguilar-Morales , Andrés F. Lasagni , Tim Kunze
{"title":"Advanced remote laser cutting of battery foils using an interference approach","authors":"Robert Baumann , Sabri Alamri , Alfredo I. Aguilar-Morales , Andrés F. Lasagni , Tim Kunze","doi":"10.1016/j.mlblux.2022.100138","DOIUrl":null,"url":null,"abstract":"<div><p>This work demonstrates how an interference pattern can improve the performance of remote laser cutting of pure copper foils, making the cutting process effective even for a low power laser source. The proof of concept is carried out by using a nanosecond laser source with a pulse duration of 5 ns, coupled with a two-beam scanning interference setup, producing a spatial period of 12.5 µm. In the experiments, processing parameters as pulse-to-pulse distance, laser power and scanning speed are varied, to optimize the foil breakthrough and their effect on the generated material modifications are investigated. A comparison between the processing results employing the interference pattern and single beam with a Gaussian energy distribution is carried out. While the single beam process is not sufficient for cutting a 10 µm thin metallic foil, the interference treatment shows an improvement over 100%. In addition, only small spatter formations are detected, with average particle sizes of 1.75 ± 0.82 µm on the top side of the foil. The bottom side of a fully separated copper foil only depicts small spatter formations of less than 1 µm.</p></div>","PeriodicalId":18245,"journal":{"name":"Materials Letters: X","volume":"14 ","pages":"Article 100138"},"PeriodicalIF":2.2000,"publicationDate":"2022-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590150822000187/pdfft?md5=1d455bfadd672e027637773d9fcb09ca&pid=1-s2.0-S2590150822000187-main.pdf","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters: X","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2590150822000187","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 1
Abstract
This work demonstrates how an interference pattern can improve the performance of remote laser cutting of pure copper foils, making the cutting process effective even for a low power laser source. The proof of concept is carried out by using a nanosecond laser source with a pulse duration of 5 ns, coupled with a two-beam scanning interference setup, producing a spatial period of 12.5 µm. In the experiments, processing parameters as pulse-to-pulse distance, laser power and scanning speed are varied, to optimize the foil breakthrough and their effect on the generated material modifications are investigated. A comparison between the processing results employing the interference pattern and single beam with a Gaussian energy distribution is carried out. While the single beam process is not sufficient for cutting a 10 µm thin metallic foil, the interference treatment shows an improvement over 100%. In addition, only small spatter formations are detected, with average particle sizes of 1.75 ± 0.82 µm on the top side of the foil. The bottom side of a fully separated copper foil only depicts small spatter formations of less than 1 µm.