IOT-based in situ condition monitoring of semiconductor fabrication equipment for e-maintenance

IF 1.8 Q3 ENGINEERING, INDUSTRIAL Journal of Quality in Maintenance Engineering Pub Date : 2021-08-05 DOI:10.1108/jqme-10-2020-0113
Youn Ji Lee, Hyuk Jun Kwon, Y. Seok, S. Hong
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Abstract

PurposeThe purpose of this paper is to demonstrate industrial Internet of Things (IIoT) solution to improve the equipment condition monitoring with equipment status data and process condition monitoring with plasma optical emission spectroscopy data, simultaneously. The suggested research contributes e-maintenance capability by remote monitoring in real time.Design/methodology/approachSemiconductor processing equipment consists of more than a thousand of components, and unreliable condition of equipment parts leads to the failure of wafer production. This study presents a web-based remote monitoring system for physical vapor deposition (PVD) systems using programmable logic controller (PLC) and Modbus protocol. A method of obtaining electron temperature and electron density in plasma through optical emission spectroscopy (OES) is proposed to monitor the plasma process. Through this system, parts that affect equipment and processes can be controlled and properly managed. It is certainly beneficial to improve the manufacturing yield by reducing errors from equipment parts.FindingsA web-based remote monitoring system provides much of benefits to equipment engineers to provide equipment data for the equipment maintenance even though they are physically away from the equipment side. The usefulness of IIoT for the e-maintenance in semiconductor manufacturing domain with the in situ monitoring of plasma parameters is convinced. The authors found the average electron temperature gradually with the increase of Ar carrier gas flow due to the increased atomic collisions in PVD process. The large amount of carrier gas flow, in this experimental case, was 90 sccm, dramatically decreasing the electron temperature, which represents kinetic energy of electrons.Research limitations/implicationsSemiconductor industries require high level of data security for the protection of their intellectual properties, and it also falls into equipment operational condition; however, data security through the Internet communication is not considered in this research, but it is already existing technology to be easily adopted by add-on feature.Practical implicationsThe findings indicate that crucial equipment parameters are the amount of carrier gas flow rate and chamber pressure among the many equipment parameters, and they also affect plasma parameters of electron temperature and electron density, which directly affect the quality of metal deposition process result on wafer. Increasing the gas flow rate beyond a certain limit can yield the electron temperature loss to have undesired process result.Originality/valueSeveral research studies on data mining with semiconductor equipment data have been suggested in semiconductor data mining domain, but the actual demonstration of the data acquisition system with real-time plasma monitoring data has not been reported. The suggested research is also valuable in terms of high cost and complicated equipment manufacturing.
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基于物联网的电子维修半导体制造设备现场状态监测
目的通过工业物联网(IIoT)解决方案,利用设备状态数据改善设备状态监测,同时利用等离子体发射光谱数据改善过程状态监测。该研究通过远程实时监控,提高了电子维修能力。设计/方法/途径半导体加工设备由一千多个部件组成,设备部件的不可靠状态导致晶圆生产失败。本研究提出了一种基于网络的物理气相沉积(PVD)系统远程监控系统,该系统使用可编程逻辑控制器(PLC)和Modbus协议。提出了一种利用光学发射光谱(OES)获取等离子体中电子温度和电子密度的方法,用于监测等离子体过程。通过该系统,可以对影响设备和过程的部件进行控制和适当管理。通过减少设备零件的误差,当然有利于提高制造成品率。基于web的远程监控系统为设备工程师提供了很多好处,即使他们远离设备端,也可以为设备维护提供设备数据。通过对等离子体参数的现场监测,证明了工业物联网在半导体制造领域电子维护中的实用性。在PVD过程中,由于原子碰撞的增加,随着载气流量的增加,平均电子温度逐渐升高。在本实验中,载气的大流量为90 sccm,极大地降低了代表电子动能的电子温度。研究局限/启示半导体行业需要高水平的数据安全来保护其知识产权,并且它也属于设备运行状态;然而,通过互联网通信的数据安全在本研究中没有考虑,但它是已经存在的技术,很容易被附加功能所采用。研究结果表明,在众多设备参数中,载气流量和腔室压力是至关重要的设备参数,它们还会影响电子温度和电子密度等等离子体参数,直接影响金属在晶圆上沉积过程的质量。将气体流速增加到一定限度以上,会使电子温度损失产生不良的工艺效果。在半导体数据挖掘领域已经提出了一些利用半导体设备数据进行数据挖掘的研究,但利用等离子体实时监测数据进行数据采集系统的实际演示尚未见报道。在高成本和复杂的设备制造方面,本研究也具有一定的参考价值。
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来源期刊
Journal of Quality in Maintenance Engineering
Journal of Quality in Maintenance Engineering Engineering-Safety, Risk, Reliability and Quality
CiteScore
4.00
自引率
13.30%
发文量
24
期刊介绍: This exciting journal looks at maintenance engineering from a positive standpoint, and clarifies its recently elevatedstatus as a highly technical, scientific, and complex field. Typical areas examined include: ■Budget and control ■Equipment management ■Maintenance information systems ■Process capability and maintenance ■Process monitoring techniques ■Reliability-based maintenance ■Replacement and life cycle costs ■TQM and maintenance
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